18517706. DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 SEO Optimized Title: Commercial Applications of Integrated Circuit with Diagonal Routing
- 1.10 Possible Prior Art
- 1.11 Unanswered Questions
- 1.12 Original Abstract Submitted
DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sheng-Hsiung Chen of Zhubei City (TW)
Jerry Chang Jui Kao of Taipei (TW)
DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517706 titled 'DIAGONAL BACKSIDE POWER AND SIGNAL ROUTING FOR AN INTEGRATED CIRCUIT
Simplified Explanation
The abstract describes an integrated circuit with a device, a first interconnect structure above the device, and a second interconnect structure below the device. The first interconnect structure has multiple frontside metal layers, while the second interconnect structure includes multiple backside metal layers with metal conductors routed diagonally.
- Integrated circuit with frontside and backside interconnect structures
- Frontside interconnect structure with multiple metal layers
- Backside interconnect structure with metal conductors routed diagonally
- Possibility of mixed-Manhattan-diagonal routing in backside interconnect structure
- Techniques for routing signals between metal conductors in backside interconnect structure and cells on frontside metal layers
Potential Applications
- High-performance computing
- Telecommunications
- Automotive electronics
Problems Solved
- Improved signal routing efficiency
- Enhanced performance of integrated circuits
- Increased reliability of connections
Benefits
- Higher speed and efficiency in signal transmission
- Reduction in signal interference
- Enhanced overall performance of electronic devices
Potential Commercial Applications
SEO Optimized Title: Commercial Applications of Integrated Circuit with Diagonal Routing
- Semiconductor industry
- Consumer electronics market
- Aerospace technology sector
Possible Prior Art
No prior art is known at this time.
Unanswered Questions
How does the integration of frontside and backside interconnect structures impact overall circuit performance?
The abstract mentions the use of both frontside and backside interconnect structures in the integrated circuit. However, it does not delve into the specific advantages or challenges posed by this integration. Further research or analysis may be needed to understand the implications of this design choice on circuit performance.
What are the specific techniques used to route signals between metal conductors in the backside interconnect structure and cells on frontside metal layers?
While the abstract mentions the existence of techniques for routing signals between different layers of the integrated circuit, it does not provide detailed information on the specific methods employed. Understanding these techniques could shed light on the efficiency and effectiveness of signal transmission within the circuit.
Original Abstract Submitted
An integrated circuit includes a device, a first interconnect structure disposed above the device and a second interconnect structure positioned below the device. The first interconnect structure includes multiple frontside metal layers. The second interconnect structure includes multiple backside metal layers, where each backside metal layer includes metal conductors routed according to diagonal routing. In some embodiments, a backside interconnect structure can include another backside metal layer that includes metal conductors routed according to mixed-Manhattan-diagonal routing. A variety of techniques can be used to route signals between metal conductors in the backside interconnect structure and cells on one or more frontside metal layers.
