18516821. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Junhee Choi of Cheonan-si (KR)
Tae-keun Kim of Cheonan-si (KR)
Kang Sul Kim of Cheonan-si (KR)
Kyeong Min Lee of Cheonan-si (KR)
Yong Jun Kim of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516821 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The substrate processing apparatus and method described in the patent application allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The apparatus includes a chamber, a chuck, a chemical liquid supply, and a pressurizer.
- The chamber has a processing space where the substrate is processed.
- The chuck is installed in the processing space to support the substrate.
- The chemical liquid supply is located on top of the chuck to supply a chemical liquid droplet onto the upper surface of the substrate.
- The pressurizer, also on top of the chuck, pressurizes the chemical liquid droplet to fill the gap between patterns on the substrate.
Potential Applications
This technology could be applied in the semiconductor industry for etching or cleaning processes where precise and deep penetration of chemical liquids is required.
Problems Solved
This technology solves the problem of inefficient penetration of chemical liquids into narrow gaps between patterns on a substrate, which can lead to incomplete processing or damage to the substrate.
Benefits
The benefits of this technology include improved processing quality, increased efficiency, and reduced substrate damage due to better penetration of chemical liquids into narrow gaps.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of microelectronics, where precise and thorough processing of substrates is crucial for the performance and reliability of the final products.
Possible Prior Art
Prior art in this field may include similar substrate processing apparatuses that aim to improve the penetration of chemical liquids into narrow gaps on substrates. However, the specific configuration and mechanism of the pressurizer in this patent application may be a novel feature.
Unanswered Questions
How does this technology compare to existing methods for improving chemical liquid penetration in substrate processing?
This article does not provide a direct comparison with existing methods or technologies in the field.
What are the limitations or potential challenges of implementing this technology in industrial-scale substrate processing facilities?
This article does not address the potential limitations or challenges of implementing this technology on a larger scale or in industrial settings.
Original Abstract Submitted
Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.
