18516750. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516750 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The abstract describes a substrate processing apparatus with an electrostatic chuck body, a substrate lifting device, and a controller for applying a control signal to the lifting device.
- Electrostatic chuck body chucks substrate using electrostatic force
- Substrate lifting device lifts substrate from chuck body
- Controller applies control signal to lifting device
- Lifting device includes movable lift pins, lift pin moving table, moving table lifting device, and load measurement
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- Potential Applications
The technology described in this patent application could be applied in semiconductor manufacturing, flat panel display production, and other industries where precise substrate handling is required.
- Problems Solved
This technology solves the problem of safely and efficiently lifting substrates from electrostatic chucks without causing damage or contamination.
- Benefits
The benefits of this technology include improved substrate handling precision, reduced risk of substrate damage, and increased overall process efficiency.
- Potential Commercial Applications
The technology could find commercial applications in semiconductor fabrication facilities, display panel manufacturing plants, and other high-tech industries requiring advanced substrate processing equipment.
- Possible Prior Art
One possible prior art for this technology could be existing substrate handling systems in semiconductor manufacturing equipment, although the specific design features outlined in this patent application may represent a novel approach to substrate lifting and handling.
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- Unanswered Questions
- How does this technology compare to traditional substrate lifting methods?
This article does not provide a direct comparison between this technology and traditional substrate lifting methods in terms of efficiency, precision, or cost-effectiveness.
- What are the potential limitations or drawbacks of this technology?
The article does not address any potential limitations or drawbacks of this technology, such as maintenance requirements, compatibility with different substrate types, or scalability to larger substrate sizes.
Original Abstract Submitted
A substrate processing apparatus includes an electrostatic chuck body configured to chuck a substrate using an electrostatic force; a substrate lifting device installed at the electrostatic chuck body and configured to lift the substrate from the electrostatic chuck body; and a controller configured to apply a control signal to the substrate lifting device, wherein the substrate lifting device includes: at least one lift pin movable so as to be in contact with the substrate; a lift pin moving table configured to support the at least one lift pin thereon and to be vertically movable; a moving table lifting device configured to vertically move the lift pin moving table; and a load measurement configured to measure a load applied to the at least one lift pin.
