18516734. TECHNIQUES FOR COUPLED HOST AND MEMORY DIES simplified abstract (Micron Technology, Inc.)

TECHNIQUES FOR COUPLED HOST AND MEMORY DIES

Organization Name

Micron Technology, Inc.

Inventor(s)

James Brian Johnson of Boise ID (US)

Brent Keeth of Boise ID (US)

Kunal R. Parekh of Boise ID (US)

Eiichi Nakano of Boise ID (US)

Amy Rae Griffin of Boise ID (US)

Ameen D. Akel of Rancho Cordova CA (US)

TECHNIQUES FOR COUPLED HOST AND MEMORY DIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18516734 titled 'TECHNIQUES FOR COUPLED HOST AND MEMORY DIES

Simplified Explanation

The patent application describes methods, systems, and devices for techniques for coupled host and memory dies. This involves distributing memory access circuitry among multiple semiconductor dies of a stack, where one die includes memory arrays and a portion of the circuitry to access them, while another die includes the remaining portion of the circuitry to access the memory arrays. The circuitry on the different dies is communicatively coupled using various interconnection techniques, such as a fusion of conductive contacts.

• Memory access circuitry distributed among multiple semiconductor dies
• First die includes memory arrays and a portion of the circuitry to access them
• Second die includes the remaining portion of the circuitry to access the memory arrays
• Circuitry on different dies communicatively coupled using interconnection techniques
• Fusion of conductive contacts used for communication between dies

Potential Applications

This technology could be applied in:

• High-performance computing systems
• Data centers
• Artificial intelligence applications

Problems Solved

This technology solves issues related to:

• Efficient memory access in stacked semiconductor devices
• Improved communication between host and memory dies
• Enhanced overall system performance

Benefits

The benefits of this technology include:

• Increased speed and efficiency in memory access
• Better utilization of stacked semiconductor devices
• Enhanced performance in data-intensive applications

Potential Commercial Applications

This technology has potential commercial applications in:

• Server systems
• Supercomputers
• Networking equipment

Possible Prior Art

One possible prior art could be the use of stacked memory dies in semiconductor devices for improved performance and efficiency.

How does this technology impact power consumption in semiconductor devices?

The patent application does not provide specific details on the impact of this technology on power consumption in semiconductor devices. Further research or experimentation may be needed to determine the exact effects.

What are the potential challenges in implementing this technology on a large scale?

The patent application does not address the potential challenges in implementing this technology on a large scale. Factors such as cost, compatibility, and scalability could be significant hurdles that need to be explored further.

Original Abstract Submitted

Methods, systems, and devices for techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of the circuitry configured to access the set of memory arrays, and a second die may include a second portion of the circuitry configured to access the set of memory arrays. The first portion and the second portion of the circuitry configured to access a set of memory arrays may be communicatively coupled between the dies using various interconnection techniques, such as a fusion of conductive contacts of the respective memory dies. In some examples, the second die may also include the host itself (e.g., a host processor).