18516711. SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM simplified abstract (Google LLC)
Contents
- 1 SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
Organization Name
Inventor(s)
Evan Jeffrey of Santa Barbara CA (US)
Joshua Yousouf Mutus of Santa Barbara CA (US)
SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516711 titled 'SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
Simplified Explanation
The method described in the abstract involves fabricating a carrier chip for distributing signals among circuit elements of a quantum computing device. Here are the key points of the innovation:
- Providing a multilayer wiring stack with alternating layers of dielectric material and wiring.
- Bonding a capping layer to the multilayer wiring stack, where the capping layer includes a single crystal silicon dielectric layer.
- Forming a via hole within the capping layer that extends to a first wiring layer of the multilayer wiring stack.
- Creating an electrically conductive via within the via hole that is electrically coupled to the first wiring layer.
- Forming a circuit element on the surface of the capping layer, directly electrically coupled to the electrically conductive via.
Potential Applications
The technology described in this patent application could be applied in the development of more efficient and compact quantum computing devices.
Problems Solved
This technology solves the problem of efficiently distributing signals among circuit elements in a quantum computing device, which is crucial for the device's overall performance.
Benefits
The benefits of this technology include improved signal distribution, enhanced performance of quantum computing devices, and potentially smaller form factors for such devices.
Potential Commercial Applications
The technology could find commercial applications in the quantum computing industry, where efficient signal distribution is essential for the development of advanced quantum computers.
Possible Prior Art
One possible prior art in this field could be the use of traditional wiring techniques in quantum computing devices, which may not be as efficient or compact as the method described in this patent application.
Unanswered Questions
How does this technology compare to existing signal distribution methods in quantum computing devices?
This article does not provide a direct comparison to existing signal distribution methods in quantum computing devices. It would be helpful to understand the advantages and disadvantages of this new method compared to traditional techniques.
What are the potential challenges in implementing this technology on a larger scale for commercial production?
The article does not address the potential challenges in scaling up this technology for commercial production. It would be important to consider factors such as cost, manufacturing processes, and compatibility with existing quantum computing systems.
Original Abstract Submitted
A method of fabricating a carrier chip for distributing signals among circuit elements of a quantum computing device, includes: providing a multilayer wiring stack, the multilayer wiring stack comprising alternating layers of dielectric material and wiring; bonding a capping layer to the multilayer wiring stack, in which the capping layer includes a single crystal silicon dielectric layer; forming a via hole within the capping layer, in which the via hole extends to a first wiring layer of the multilayer wiring stack; forming an electrically conductive via within the via hole and electrically coupled to the first wiring layer; and forming a circuit element on a surface of the capping layer, in which the circuit element is directly electrically coupled to the electrically conductive via.
