18516402. PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
- 1 PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Kenta Kondo of Nagaokakyo-shi (JP)
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516402 titled 'PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation
The photosensitive conductive paste described in the patent application includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is coated with a glass with a glass softening point (Ts) of 800°C or lower.
- Conductive powder coated with glass with low softening point
- Includes alkali-soluble polymer, photosensitive monomer, photopolymerization initiator, dispersant, and solvent
Potential Applications
The technology could be used in the manufacturing of printed circuit boards, flexible electronics, touchscreens, and sensors.
Problems Solved
This innovation solves the problem of creating highly conductive and photosensitive pastes for use in electronic applications.
Benefits
The benefits of this technology include improved conductivity, photosensitivity, and adhesion properties in electronic applications.
Potential Commercial Applications
The technology could be commercially applied in the electronics industry for the production of high-quality electronic components.
Possible Prior Art
Prior art may include other photosensitive conductive pastes with different compositions and properties.
Unanswered Questions
How does the glass coating affect the conductivity of the paste?
The glass coating may act as a barrier to prevent oxidation of the conductive powder, leading to improved conductivity.
What is the shelf life of the photosensitive conductive paste?
The shelf life may depend on factors such as storage conditions and the stability of the photosensitive components in the paste.
Original Abstract Submitted
A photosensitive conductive paste includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is covered with a glass having a glass softening point (Ts) of 800° C. or lower.
