18515780. SUBSTRATE POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE POLISHING APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
SUBSTRATE POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515780 titled 'SUBSTRATE POLISHING APPARATUS
Simplified Explanation: This patent application describes a substrate polishing apparatus that includes a platen for polishing semiconductor substrates, a slurry supply for providing slurry between the substrate and the platen, a circular substrate holder to hold the substrate in contact with the platen, a temperature controller to regulate the platen's temperature through direct contact, and a cleaning component to supply a cleaning solution to the substrate holder and temperature controller.
Key Features and Innovation:
- Platen for polishing semiconductor substrates
- Slurry supply for providing slurry between substrate and platen
- Circular substrate holder for holding and contacting the substrate with the platen
- Temperature controller for regulating platen temperature through direct contact
- Cleaning component for supplying cleaning solution to substrate holder and temperature controller
Potential Applications: The technology can be used in semiconductor manufacturing processes, specifically in substrate polishing applications.
Problems Solved: The technology addresses the need for precise temperature control during substrate polishing processes, as well as the need for effective cleaning solutions for maintaining equipment.
Benefits:
- Improved substrate polishing efficiency
- Enhanced temperature control for better polishing results
- Simplified cleaning process for equipment maintenance
Commercial Applications: Potential commercial applications include semiconductor manufacturing companies, research institutions, and companies involved in the production of electronic components.
Prior Art: Readers can start searching for prior art related to this technology by looking into patents or research papers on substrate polishing apparatus, temperature control in semiconductor manufacturing, and cleaning solutions for semiconductor equipment.
Frequently Updated Research: Stay updated on the latest advancements in substrate polishing technology, temperature control methods in semiconductor manufacturing, and innovative cleaning solutions for semiconductor equipment.
Questions about Substrate Polishing Apparatus: 1. What are the key components of a substrate polishing apparatus and how do they work together? 2. How does the temperature controller in this substrate polishing apparatus improve the polishing process?
Original Abstract Submitted
A substrate polishing apparatus includes a platen having an upper surface configured to polish a semiconductor substrate, a slurry supply configured to supply slurry between the semiconductor substrate and the platen, a substrate holder configured to hold the semiconductor substrate and to bring the semiconductor substrate in contact with the upper surface of the platen, the substrate holder having a circular shape, a temperature controller configured to control temperature of the platen through thermal transfer via direct contact, wherein the temperature controller has a thermal conductive body that has an arc shape and the thermal conductive body is spaced apart from the substrate holder and surrounds at least a portion of the substrate holder, and a cleaning component configured to supply a cleaning solution to the substrate holder and the temperature controller.
