18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)

Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories

Organization Name

Apple Inc.

Inventor(s)

Sukalpa Biswas of Fremont CA (US)

Farid Nemati of Redwood City CA (US)

Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories - A simplified explanation of the abstract

This abstract first appeared for US patent application 18515649 titled 'Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories

Simplified Explanation

The abstract describes a memory system that includes at least two types of DRAM, each with different characteristics such as density, latency, and bandwidth. The DRAM types are located on separate integrated circuits, which can be stacked together. The second integrated circuit includes a physical layer circuit shared by the DRAM in the first integrated circuits.

• The memory system includes at least two types of DRAM with different characteristics.
• One DRAM type is high density, while the other has lower density but lower latency and higher bandwidth.
• The DRAM types are on separate integrated circuits, which can be stacked together.
• The second integrated circuit includes a physical layer circuit shared by the DRAM in the first integrated circuits.

Potential Applications

This technology could be applied in:

• High-performance computing systems
• Data centers
• Artificial intelligence applications

Problems Solved

This technology helps address:

• Memory bottlenecks in high-performance systems
• Improving overall system performance
• Enhancing memory access speeds

Benefits

The benefits of this technology include:

• Increased memory performance
• Better system efficiency
• Enhanced data processing capabilities

Potential Commercial Applications

Potential commercial applications of this technology could be in:

• Server systems
• Supercomputers
• Networking equipment

Possible Prior Art

One possible prior art could be the use of stacked memory modules in high-performance computing systems to improve memory access speeds and overall system performance.

Unanswered Questions

How does this technology impact power consumption in memory systems?

This article does not address the potential impact of this technology on power consumption in memory systems. It would be interesting to explore whether the use of different types of DRAM affects power efficiency.

Are there any limitations to the scalability of this memory system?

The article does not discuss any potential limitations to the scalability of this memory system. It would be important to understand if there are any constraints on expanding this technology to larger memory configurations.

Original Abstract Submitted

In an embodiment, a memory system may include at least two types of DRAM, which differ in at least one characteristic. For example, one DRAM type may be a high density DRAM, while another DRAM type may have lower density but may also have lower latency and higher bandwidth than the first DRAM type. DRAM of the first type may be on one or more first integrated circuits and DRAM of the second type may be on one or more second integrated circuits. In an embodiment, the first and second integrated circuits may be coupled together in a stack. The second integrated circuit may include a physical layer circuit to couple to other circuitry (e.g., an integrated circuit having a memory controller, such as a system on a chip (SOC)), and the physical layer circuit may be shared by the DRAM in the first integrated circuits.