18515426. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Organization Name
Inventor(s)
Takahito Nakashoya of Hillsboro OR (US)
Takayuki Matsukawa of Hillsboro OR (US)
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515426 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Simplified Explanation
The patent application describes a method for processing a substrate by using a chemical liquid and a heated fluid to improve the efficiency of the process.
- The method involves supplying a chemical liquid to one surface of the substrate while simultaneously heating the substrate by supplying a heated fluid to the opposite surface.
- The temperature of either the chemical liquid or the heated fluid is adjusted based on the standby time of the chemical liquid discharge, ensuring optimal processing conditions.
- By pre-heating the substrate before applying the chemical liquid, the method aims to enhance the overall processing performance and quality of the substrate.
Potential Applications
This technology could be applied in various industries such as semiconductor manufacturing, solar panel production, and electronic device fabrication.
Problems Solved
This method solves the problem of inconsistent substrate processing by adjusting the temperature of the chemical liquid and heated fluid based on standby time, resulting in more uniform and efficient processing.
Benefits
- Improved processing efficiency - Enhanced substrate quality - Reduced processing time and costs
Potential Commercial Applications
- Semiconductor manufacturing - Solar panel production - Electronic device fabrication
Possible Prior Art
There may be prior art related to substrate processing methods using chemical liquids and heated fluids, but specific examples are not provided in the patent application.
Unanswered Questions
How does this method compare to traditional substrate processing techniques?
The article does not provide a direct comparison between this method and traditional techniques in terms of efficiency, cost, and quality of the processed substrates.
Are there any limitations or challenges associated with implementing this method on an industrial scale?
The patent application does not address any potential limitations or challenges that may arise when implementing this method on a larger, industrial scale.
Original Abstract Submitted
A substrate processing method includes processing a first surface of a substrate by a chemical liquid supplied to the first surface from a chemical liquid supply; and heating the substrate by starting a supply of a heated fluid to a second surface of the substrate prior to a start of a supply of the chemical liquid to the first surface of the substrate. A temperature of at least one of the chemical liquid to be supplied to the first surface or the heated fluid to be supplied to the second surface is adjusted based on a chemical liquid discharge standby time during which a discharge of the chemical liquid from the chemical liquid supply is not performed continuously.
