18515412. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Okgyeong Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18515412 titled 'SEMICONDUCTOR PACKAGE
The inventive concept provides a semiconductor package with a unique dam structure surrounding the semiconductor chip.
- The semiconductor package includes a substrate with a passivation layer, a semiconductor chip mounted on the substrate, an underfill material layer, and a dam structure.
- The lower portion of the dam structure is in contact with the passivation layer and is made of the same material as the passivation layer.
- The upper surface of the dam structure has two segments at different vertical levels, providing structural integrity and protection for the semiconductor chip.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides enhanced protection for the semiconductor chip against external elements and mechanical stress. - Improves the reliability and longevity of electronic devices by preventing damage to the semiconductor components.
Benefits: - Increased durability and reliability of electronic devices. - Enhanced performance and functionality of semiconductor packages. - Cost-effective manufacturing process for semiconductor packaging.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Reliability This technology can be utilized by semiconductor manufacturers, electronics companies, and device manufacturers to improve the quality and performance of their products. It can lead to the development of more robust and reliable electronic devices, attracting a wider customer base and increasing market competitiveness.
Questions about Semiconductor Packaging Technology: 1. How does the unique dam structure improve the reliability of semiconductor packages? - The dam structure provides additional protection and support for the semiconductor chip, reducing the risk of damage from external factors. 2. What are the potential cost savings associated with implementing this advanced semiconductor packaging technology? - By enhancing the durability and reliability of electronic devices, manufacturers can reduce warranty claims and repair costs, leading to overall cost savings in the long run.
Original Abstract Submitted
The inventive concept provides a semiconductor package including a substrate including a passivation layer, a semiconductor chip mounted on the substrate, an underfill material layer between the semiconductor chip and the substrate, and a dam structure on the substrate and surrounding the semiconductor chip, wherein a lower portion of the dam structure is in contact with the passivation layer and is formed of a material that is the same as a material forming the passivation layer, and an upper surface of the dam structure includes a first segment at a first vertical level and a second segment at a second vertical level, wherein the second vertical level is different from the first vertical level.
