18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Yu-Sheng Lin of Hsinchu County (TW)

Chin-Hua Wang of New Taipei City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Chien-Hung Chen of Taipei (TW)

Po-Yao Lin of Hsinchu County (TW)

Shin-Puu Jeng of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18515264 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Simplified Explanation

The semiconductor package described in the patent application includes a redistribution structure, two semiconductor devices, an underfill layer, and an encapsulant. The first semiconductor device is connected to the redistribution structure and has specific surface characteristics, while the second semiconductor device is also connected to the redistribution structure and has surface characteristics that interact with those of the first semiconductor device. The underfill layer is positioned between the two semiconductor devices and the redistribution structure, while the encapsulant covers all components.

• The semiconductor package includes a redistribution structure, two semiconductor devices, an underfill layer, and an encapsulant.
• The first semiconductor device has specific surface characteristics, including a first bottom surface, a first top surface, and a first side surface with sub-surfaces and obtuse angles.
• The second semiconductor device has surface characteristics that interact with those of the first semiconductor device.
• The underfill layer is positioned between the two semiconductor devices and the redistribution structure.
• The encapsulant covers all components of the semiconductor package.

Potential Applications

• Advanced electronic devices
• Semiconductor manufacturing industry
• Consumer electronics

Problems Solved

• Improved electrical connections between semiconductor devices
• Enhanced structural integrity of semiconductor packages
• Better thermal management in electronic devices

Benefits

• Increased reliability of electronic devices
• Higher performance capabilities
• Extended lifespan of semiconductor packages

Original Abstract Submitted

An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface. The second semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the second semiconductor device has a second bottom surface, a second top surface and a second side surface connecting with the second bottom surface and the second top surface, the second side surface faces toward to the first side surface, the second side surface comprises a third sub-surface and a fourth sub-surface connected with each other, the third sub-surface is connected with the second bottom surface, and a second obtuse angle is between the third sub-surface and the fourth sub-surface. The underfill layer is between the first semiconductor device and the second semiconductor device, between the first semiconductor device and the redistribution structure, and between the second semiconductor device and the redistribution structure. The encapsulant encapsulates the first semiconductor device, the second semiconductor device and the underfill layer.