18514862. MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract (KIA CORPORATION)
Contents
- 1 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-si (KR)
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18514862 titled 'MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Simplified Explanation
The patent application describes a multi-layered spacer with controllable thermal expansion coefficient and thermal conductivity, used in a double-sided cooling power module between a semiconductor chip and a substrate.
- The multi-layered spacer includes first metal layers as outermost layers and a second metal layer with a lower thermal expansion coefficient between the first metal layers.
- The spacer helps manage thermal expansion and conductivity in the cooling power module.
Potential Applications
The technology can be applied in various electronic devices requiring efficient cooling systems, such as computers, servers, and mobile devices.
Problems Solved
The innovation addresses issues related to thermal management in electronic devices, ensuring optimal performance and preventing overheating.
Benefits
The multi-layered spacer improves heat dissipation, extends the lifespan of electronic components, and enhances overall device performance.
Potential Commercial Applications
The technology can be utilized by electronics manufacturers to enhance the cooling systems of their products, leading to more reliable and efficient devices.
Possible Prior Art
One possible prior art could be the use of traditional thermal interface materials in electronic devices, which may not offer the same level of control over thermal expansion and conductivity as the multi-layered spacer described in the patent application.
Unanswered Questions
How does the cost of implementing this technology compare to traditional cooling solutions?
The article does not provide information on the cost implications of using the multi-layered spacer compared to other cooling methods.
Are there any limitations to the size or shape of the semiconductor chips that can be accommodated by this technology?
The article does not address whether the design of the multi-layered spacer imposes any restrictions on the size or shape of the semiconductor chips it can support.
Original Abstract Submitted
A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
