18514862. MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME simplified abstract (HYUNDAI MOTOR COMPANY)
Contents
- 1 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-si (KR)
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18514862 titled 'MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME
Simplified Explanation
The patent application describes a multi-layered spacer with controllable thermal expansion coefficient and thermal conductivity, used in a double-sided cooling power module between a semiconductor chip and a substrate.
- The multi-layered spacer includes first metal layers as outermost layers and a second metal layer with a lower thermal expansion coefficient between the first metal layers.
- The double-sided cooling power module incorporates the multi-layered spacer to enhance thermal management in electronic devices.
Potential Applications
The technology can be applied in:
- High-performance computing systems
- Automotive electronics
Problems Solved
- Improved thermal management in electronic devices
- Enhanced reliability and performance of semiconductor chips
Benefits
- Better heat dissipation
- Increased longevity of electronic components
Potential Commercial Applications
- Data centers
- Electric vehicles
Possible Prior Art
One possible prior art could be the use of thermal interface materials in electronic devices to improve heat dissipation.
Unanswered Questions
How does the multi-layered spacer impact the overall size of the double-sided cooling power module?
The article does not provide information on whether the multi-layered spacer affects the overall dimensions of the cooling module.
What is the cost implication of integrating the multi-layered spacer in electronic devices?
The article does not address the potential cost implications of implementing this technology in commercial applications.
Original Abstract Submitted
A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
