18514763. COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (Micron Technology, Inc.)
Contents
- 1 COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Device Assembly Cooling System
- 1.13 Original Abstract Submitted
COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY
Organization Name
Inventor(s)
Ravi Kumar Kollipara of Puppalaguda (IN)
Suresh Reddy Yarragunta of Bangalore (IN)
COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18514763 titled 'COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY
Simplified Explanation
The patent application describes a semiconductor device assembly with a cooling system that uses fluid to transfer heat away from the semiconductor die.
- The semiconductor die is mounted on a substrate with a channel at the back to allow fluid flow.
- Fluid enters through an inlet, flows through the channel, absorbs heat, and exits through an outlet.
- This system efficiently cools the semiconductor device assembly.
Key Features and Innovation
- Cooling system for semiconductor device assembly.
- Channel at the back of the semiconductor die for fluid flow.
- Inlet and outlet for fluid circulation.
- Efficient heat transfer mechanism.
Potential Applications
The technology can be used in various semiconductor devices, such as CPUs, GPUs, and power electronics, to improve thermal management and performance.
Problems Solved
- Overheating of semiconductor devices.
- Inefficient cooling systems.
- Thermal throttling affecting performance.
Benefits
- Improved thermal management.
- Enhanced performance and reliability.
- Compact and effective cooling solution.
Commercial Applications
- Data centers
- Consumer electronics
- Automotive industry
Prior Art
Readers can explore prior patents related to semiconductor cooling systems, fluid cooling technologies, and thermal management in electronic devices.
Frequently Updated Research
Stay updated on advancements in semiconductor cooling technologies, fluid dynamics in cooling systems, and materials for efficient heat transfer.
Questions about Semiconductor Device Assembly Cooling System
How does the fluid cooling system benefit semiconductor devices?
The fluid cooling system efficiently transfers heat away from the semiconductor die, preventing overheating and improving performance and reliability.
What are the potential commercial applications of this technology?
This technology can be applied in data centers, consumer electronics, and the automotive industry to enhance thermal management and device performance.
Original Abstract Submitted
A semiconductor device assembly is provided that includes a cooling system. The semiconductor device assembly includes a semiconductor die assembled onto a substrate. A channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. The fluid is received through an inlet to enable the fluid to be flowed through the channel. After the fluid is flowed through the channel, the fluid is expelled through an outlet. In this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.
