18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Kyoungwoo Lee of Suwon-si (KR)

Anthony Dongick Lee of Suwon-si (KR)

Kyungmin Kim of Hwaseong-si (KR)

Gukhee Kim of Suwon-si (KR)

Beomjin Kim of Suwon-si (KR)

Youngwoo Kim of Hwaseong-si (KR)

Sangcheol Na of Suwon-si (KR)

Myeonggyoon Chae of Suwon-si (KR)

Seungseok Ha of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18514054 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the patent application includes a semiconductor substrate with a main chip region and a sealing region, front and back wiring layers with different wiring structures, and ring structures in the sealing region.

• The semiconductor device has a semiconductor substrate with distinct regions and wiring layers on both surfaces.
• The front wiring layer on the first surface includes a front wiring structure, while the back wiring layer on the second surface includes a power wiring structure.
• Ring structures are present in both the front and back wiring layers within the sealing region of the semiconductor substrate.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial machinery, and communication equipment.

Problems Solved: - Provides efficient wiring solutions for semiconductor devices with different functional requirements on each surface. - Enhances the overall performance and reliability of the semiconductor device.

Benefits: - Improved functionality and performance of electronic devices. - Enhanced durability and longevity of semiconductor components.

Commercial Applications: Title: Semiconductor Device with Enhanced Wiring Structures for Improved Performance This technology can be utilized by semiconductor manufacturers to produce high-performance electronic devices with advanced wiring solutions, catering to a wide range of industries and applications.

Prior Art: Readers can explore prior patents related to semiconductor wiring structures and substrate designs to understand the evolution of similar technologies in the field.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor wiring technologies and substrate designs to incorporate cutting-edge solutions in electronic devices.

Questions about Semiconductor Device with Enhanced Wiring Structures: 1. How does the presence of ring structures in the front and back wiring layers impact the overall performance of the semiconductor device? 2. What are the specific advantages of having different wiring structures on the front and back layers of the semiconductor substrate?

Original Abstract Submitted

A semiconductor device includes a semiconductor substrate having a first surface and a second surface facing the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semiconductor substrate and including a front wiring structure, a back wiring layer on the second surface of the semiconductor substrate and including a power wiring structure, a front ring structure in the front wiring layer of the sealing region, and a back ring structure in the back wiring layer of the sealing region.