18513994. PROCESSING APPARATUS AND PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
Contents
- 1 PROCESSING APPARATUS AND PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESSING APPARATUS AND PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PROCESSING APPARATUS AND PROCESSING METHOD
Organization Name
Inventor(s)
Masami Oikawa of Oshu City (JP)
PROCESSING APPARATUS AND PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513994 titled 'PROCESSING APPARATUS AND PROCESSING METHOD
Simplified Explanation
The patent application describes a processing apparatus with a film formation gas supply path and an exhaust system for depressurizing the processing container.
- The processing apparatus includes a processing container that can be depressurized.
- A film formation gas supply path is designed to supply a film formation gas into the processing container.
- An exhaust pipe is connected to the processing container to exhaust the film formation gas, with a branch pipe branching from it.
- A diaphragm vacuum gauge is connected to the branch pipe to monitor the pressure within the system.
- The exhaust pipe or branch pipe has a material that promotes consumption of the film formation gas on its inner surface.
Potential Applications
The technology described in this patent application could be used in various industries such as semiconductor manufacturing, thin film deposition, and chemical vapor deposition processes.
Problems Solved
This technology helps in controlling the pressure and gas flow within a processing container, ensuring efficient and precise film formation processes.
Benefits
The apparatus allows for accurate monitoring and control of the film formation gas supply, leading to improved film quality and production efficiency.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices that require precise thin film deposition processes.
Possible Prior Art
One possible prior art could be similar processing apparatus used in semiconductor manufacturing or other industries where film formation processes are employed.
Unanswered Questions
How does this technology compare to existing film formation gas supply systems in terms of efficiency and precision?
This article does not provide a direct comparison between this technology and existing systems in terms of efficiency and precision.
What are the specific materials used in the exhaust pipe or branch pipe to promote consumption of the film formation gas?
The article does not specify the exact materials used to promote the consumption of the film formation gas within the exhaust or branch pipes.
Original Abstract Submitted
A processing apparatus includes: a processing container configured to be depressurized; a film formation gas supply path configured to supply a film formation gas into the processing container; an exhaust pipe connected to the processing container and configured to exhaust the film formation gas in the processing container; a branch pipe branching from the exhaust pipe; and a diaphragm vacuum gauge connected to the branch pipe, wherein at least one of the exhaust pipe or the branch pipe has an inner surface where a material that promotes consumption of the film formation gas is exposed.
