18513863. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seunghoon Yeon of Suwon-si (KR)
Seungryong Oh of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513863 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of two semiconductor chips, with the first chip containing electrode bundles arranged in an array on a substrate, each bundle having through electrodes penetrating the substrate. The first chip also includes a backside insulating layer with electrode pads on the bundles.
- The first semiconductor chip has electrode bundles with through electrodes and electrode pads.
- The backside insulating layer on the first chip includes a trench between electrode bundles.
- The electrode pads on the first chip have protruding portions that fill the trenches in the insulating layer.
Potential Applications: - This technology could be used in various electronic devices that require high-performance semiconductor packages. - It may find applications in industries such as telecommunications, computing, and consumer electronics.
Problems Solved: - Provides a more efficient and reliable way to package semiconductor chips. - Helps improve the performance and durability of electronic devices.
Benefits: - Enhanced electrical connectivity and thermal management. - Increased reliability and longevity of semiconductor packages. - Potential for smaller and more compact electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology could be utilized in the production of smartphones, laptops, servers, and other electronic devices that require high-speed processing and reliability. The market implications include improved product performance, reduced maintenance costs, and increased consumer satisfaction.
Prior Art: Readers interested in exploring prior art related to this technology could start by researching semiconductor packaging methods, advanced electrode technologies, and insulating layers in semiconductor devices.
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the performance and efficiency of semiconductor packaging. Stay updated on the latest developments in semiconductor packaging technology to leverage the full potential of this innovation.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve the overall performance of electronic devices? - This technology enhances electrical connectivity and thermal management, leading to improved efficiency and reliability in electronic devices.
2. What sets this semiconductor packaging technology apart from traditional packaging methods? - The use of electrode bundles with through electrodes and protruding electrode pads in conjunction with a backside insulating layer distinguishes this technology from conventional packaging methods.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of electrode bundles arranged in an array in a first substrate and each having a plurality of through electrodes penetrating the first substrate, a backside insulating layer on a backside surface of the first substrate through which end portions of the through electrodes are exposed, and a plurality of electrode pads respectively provided on the electrode bundles. The backside insulating layer has a first trench formed between the through electrodes of a first electrode bundle. A first electrode pad is disposed on the through electrodes of a first electrode bundle and includes a protruding portion that fills the first trench of the backside insulating layer.
