18513644. SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chih-Hsuan Tai of Taipei City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Yu-Chih Huang of Hsinchu (TW)

Chih-Hao Chang of Hsinchu County (TW)

Chia-Hung Liu of Hsinchu City (TW)

Ban-Li Wu of Hsinchu City (TW)

Ying-Cheng Tseng of Tainan City (TW)

Po-Chun Lin of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18513644 titled 'SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

Simplified Explanation

The semiconductor package described in the patent application includes a heat dissipation substrate with conductive through-vias, a sensor die, insulating encapsulant, redistribution structures, and a window for light sensing.

• Heat dissipation substrate with embedded conductive through-vias
• Sensor die placed on the substrate and encapsulated laterally
• Second conductive through-via connecting with the first via
• Redistribution structures on opposite sides of the substrate
• Window in the second redistribution structure for light sensing
• Electrical connection between sensor die and redistribution structures through through-vias

Potential Applications

• Sensing applications in electronic devices
• Light sensing technology in cameras or optical sensors

Problems Solved

• Efficient heat dissipation in semiconductor packages
• Improved electrical connections between components
• Enhanced light sensing capabilities

Benefits

• Better performance and reliability of electronic devices
• Increased functionality in sensors and cameras
• Enhanced thermal management for semiconductor components

Original Abstract Submitted

A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure. A method of forming the semiconductor package is also provided.