18513545. METHODS FOR WAFER BONDING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 METHODS FOR WAFER BONDING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS FOR WAFER BONDING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Wafer Bonding
- 1.13 Original Abstract Submitted
METHODS FOR WAFER BONDING
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Wei Chang of Hsin-Chu (TW)
Ren-Dou Lee of Hsinchu City (TW)
Yi-Chih Chang of Hsin-Chu (TW)
Yi-Hsun Chiu of Zhubei City (TW)
Yuan-Hsin Chi of Taichung County (TW)
METHODS FOR WAFER BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513545 titled 'METHODS FOR WAFER BONDING
Simplified Explanation
This patent application discloses methods for improving wafer bonding performance by processing semiconductor substrates using chemical vapor deposition (CVD) and chemical mechanical polishing (CMP) before bonding them together.
- The method involves processing semiconductor substrates through CVD and CMP techniques.
- One CVD process is performed after all CMP processes and before bonding the substrates.
Key Features and Innovation
- Utilizes CVD and CMP techniques to enhance wafer bonding performance.
- Sequential processing steps ensure optimal bonding between semiconductor substrates.
Potential Applications
This technology can be applied in the semiconductor industry for manufacturing advanced electronic devices. It can also be used in the production of integrated circuits and microelectromechanical systems (MEMS).
Problems Solved
- Improves the quality and reliability of wafer bonding in semiconductor manufacturing.
- Enhances the overall performance of electronic devices by ensuring strong bonds between substrates.
Benefits
- Increased efficiency in semiconductor manufacturing processes.
- Enhanced device performance and reliability.
- Cost-effective method for improving wafer bonding quality.
Commercial Applications
- Semiconductor manufacturing industry for producing high-performance electronic devices.
- MEMS industry for creating precise and reliable microsystems.
Prior Art
There may be prior research on the use of CVD and CMP techniques in semiconductor processing for improving wafer bonding performance. Researchers can explore academic journals and patent databases for relevant information.
Frequently Updated Research
Researchers are continually exploring new methods and materials to enhance wafer bonding performance in semiconductor manufacturing. Stay updated on the latest advancements in CVD and CMP technologies for improved bonding results.
Questions about Wafer Bonding
What are the key challenges in wafer bonding technology?
Wafer bonding technology faces challenges such as achieving uniform bonding across large surface areas and ensuring strong adhesion between substrates.
How does wafer bonding impact the performance of electronic devices?
Wafer bonding directly affects the reliability and functionality of electronic devices by influencing the quality of interconnections between semiconductor components.
Original Abstract Submitted
Methods for improving wafer bonding performance are disclosed herein. In some embodiments, a method for bonding a pair of semiconductor substrates is disclosed. The method includes: processing at least one of the pair of semiconductor substrates, and bonding the pair of semiconductor substrates together. Each of the pair of semiconductor substrates is processed by: performing at least one chemical vapor deposition (CVD), and performing at least one chemical mechanical polishing (CMP). One of the at least one CVD is performed after all CMP performed before bonding.
