18513248. MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD simplified abstract (STMICROELECTRONICS S.r.l.)
Contents
- 1 MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD
Organization Name
Inventor(s)
Domenico Giusti of Caponago (IT)
Marco Ferrera of Concorezzo (IT)
Carlo Luigi Prelini of Seveso (IT)
Alessandro Stuart Savoia of Roma (IT)
MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18513248 titled 'MEMS TRANSDUCER DEVICE FOR HIGH-FREQUENCY APPLICATIONS, AND MANUFACTURING METHOD
Simplified Explanation
The MEMS device described in the patent application includes a signal processing assembly, a transduction module with multiple transducer devices, a stiffening structure surrounding each transducer device, and coupling pillars for physical and electrical connection between the transduction module and the signal processing assembly.
- The conductive coupling elements have a specific shape, such as hypocycloid, triangular, or quadrangular, to maximize the overlapping surface with the stiffening structure around each transducer device.
- The coupling pillars are designed to carry control signals of the transducer devices and ensure efficient communication between the transduction module and the signal processing assembly.
Potential Applications
The technology described in the patent application could be used in various applications such as:
- Medical devices
- Acoustic sensors
- Gyroscopes
- Pressure sensors
Problems Solved
This technology addresses the following issues:
- Ensuring proper communication between transducer devices and signal processing assembly
- Enhancing the structural integrity of MEMS devices
- Improving the overall performance and reliability of MEMS devices
Benefits
The benefits of this technology include:
- Increased efficiency in signal processing
- Enhanced durability and stability of MEMS devices
- Improved accuracy and sensitivity in sensing applications
Potential Commercial Applications
The technology has potential commercial applications in industries such as:
- Healthcare
- Aerospace
- Automotive
- Consumer electronics
Possible Prior Art
One possible prior art in this field is the use of coupling pillars in MEMS devices for connecting transducer devices to signal processing units. However, the specific design of the conductive coupling elements to maximize surface contact with the stiffening structure may be a novel aspect of this innovation.
Unanswered Questions
How does this technology compare to existing MEMS devices in terms of size and power consumption?
The article does not provide information on the size and power consumption of the MEMS device compared to existing technologies. This information would be crucial for understanding the practical implications and advantages of the innovation.
What are the potential challenges in implementing this technology on a large scale for commercial production?
The article does not address the potential challenges that may arise in scaling up the production of MEMS devices using this technology. Factors such as cost, manufacturing complexity, and compatibility with existing production processes could be significant considerations in commercialization.
Original Abstract Submitted
MEMS device comprising: a signal processing assembly; a transduction module comprising a plurality of transducer devices; a stiffening structure at least partially surrounding each transducer device; one or more coupling pillars for each transducer device, extending on the stiffening structure and configured to physically and electrically couple the transduction module to the signal processing assembly, to carry control signals of the transducer devices. Each conductive coupling element has a section having a shape such as to maximize the overlapping surface with the stiffening structure around the respective transducer device. This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.
