18512375. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Hyeonjeong Kim of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18512375 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor chip described in the patent application includes a semiconductor substrate with an active surface and an inactive surface, a multi-wiring layer on the active surface, a lower protection layer with a conductive medium pad, through vias penetrating the substrate, and back side pads on the inactive surface connected to the through vias.
- The semiconductor chip features a multi-wiring layer with at least two layers, including a conductive wiring and a dummy wiring.
- The lower protection layer includes a conductive medium pad connected to the conductive wiring.
- The through vias consist of power through vias, signal through vias, and dummy through vias.
- The back side pads on the inactive surface are connected to the through vias, with the dummy through vias linked to the wiring structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications. - It can improve the performance and reliability of integrated circuits in electronic devices.
Problems Solved: - Enhances the connectivity and protection of semiconductor chips. - Facilitates the integration of multiple wiring layers in semiconductor devices.
Benefits: - Improved functionality and efficiency of semiconductor chips. - Enhanced durability and reliability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Connectivity This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and IoT devices, improving their overall functionality and reliability in the market.
Questions about the technology: 1. How does the integration of dummy wiring in the multi-wiring layer benefit the semiconductor chip? 2. What are the specific advantages of using through vias in the semiconductor substrate for connectivity and protection?
Original Abstract Submitted
A semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface facing the active surface, a multi wiring layer arranged on the active surface of the semiconductor substrate, and including a wiring structure having at least two layers and including a conductive wiring and a dummy wiring, a lower protection layer arranged on a front surface of the multi wiring layer, and including a conductive medium pad connected to the conductive wiring, a plurality of through vias configured to penetrate the semiconductor substrate, and including a plurality of power through vias, a plurality of signal through vias, and a plurality of dummy through vias; and a plurality of back side pads arranged on the inactive surface of the semiconductor substrate, and connected to the plurality of through vias, wherein the plurality of dummy through vias are connected to the wiring structure.
