18512199. PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about the Technology
- 1.11 Original Abstract Submitted
PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18512199 titled 'PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The processor chip for a semiconductor package has chip pads on one surface connected to a package substrate, with the surface divided into two areas.
- The processor chip has chip pads on one surface connected to a package substrate.
- The surface is divided into a first area with four sides and a second area at the center.
- The chip pads are located on the first area and arranged in a line along at least a portion of a side.
Key Features and Innovation
- Chip pads on one surface connected to a package substrate.
- Surface divided into two areas for efficient layout.
- Chip pads arranged in a line along a side for optimized connectivity.
Potential Applications
This technology can be used in various semiconductor packages and electronic devices requiring efficient chip pad layout.
Problems Solved
Efficient chip pad layout for improved connectivity and performance in semiconductor packages.
Benefits
- Enhanced connectivity between chip pads and package substrate.
- Improved performance and reliability of electronic devices.
Commercial Applications
This technology can be applied in the manufacturing of semiconductor packages for a wide range of electronic devices, including smartphones, computers, and IoT devices.
Questions about the Technology
What are the potential applications of this processor chip technology?
This technology can be applied in various semiconductor packages and electronic devices requiring efficient chip pad layout.
How does the division of the surface into two areas benefit the processor chip design?
The division of the surface into two areas allows for an optimized layout of chip pads, enhancing connectivity and performance.
Original Abstract Submitted
A processor chip for a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface and mounted on a package substrate, and a plurality of chip pads disposed on the first surface of the substrate and electrically connected to the package substrate, wherein the first surface is divided into a first area and a second area, the first area includes four sides of the first surface and the second area includes a center of the first surface, and the plurality of chip pads are located on the first area and are arranged on at least a portion of a side of the first surface in a line along the side.
