18511890. SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD
Organization Name
Inventor(s)
Yusuke Kikuchi of Yamanashi (JP)
SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18511890 titled 'SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD
Simplified Explanation
The substrate processing apparatus described in the patent application includes a processing chamber, a rotatable substrate support, a freezing device to cool the substrate support, a mechanism to rotate the substrate support and move the freezing device, a power supply part for RF power, and a power supply line that controls the supply of RF power to the substrate support.
- The apparatus comprises a processing chamber for substrate processing.
- A rotatable substrate support is used to hold the substrate in the processing chamber.
- A freezing device cools the substrate support, either in contact with it or separated.
- A mechanism is in place to rotate the substrate support and move the freezing device.
- A power supply part is responsible for supplying RF power.
- A power supply line penetrates through the freezing device and controls the supply of RF power by connecting or disconnecting from a specific position on the substrate support.
Potential Applications
The technology described in this patent application could be applied in semiconductor manufacturing, thin film deposition, and other industries that require precise control over substrate temperature during processing.
Problems Solved
This technology solves the problem of maintaining a stable and controlled temperature for substrates during processing, which is crucial for achieving high-quality results in various manufacturing processes.
Benefits
The benefits of this technology include improved process efficiency, higher quality end products, and increased control over substrate temperature, leading to better overall performance in substrate processing.
Potential Commercial Applications
Potential commercial applications for this technology include semiconductor fabrication facilities, research institutions, and companies involved in thin film deposition processes.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus with freezing devices, but the specific configuration and control mechanism described in this patent application may be unique.
Unanswered Questions
How does the freezing device maintain contact with the substrate support during rotation?
The patent application does not provide detailed information on how the freezing device remains in contact with the substrate support while it rotates. This could be crucial for understanding the practical implementation of the apparatus.
What is the specific mechanism used to raise and lower the freezing device?
The patent application mentions a mechanism to move the freezing device, but it does not specify the exact mechanism or technology used for this purpose. Understanding this mechanism could provide insights into the overall design and functionality of the substrate processing apparatus.
Original Abstract Submitted
Provided is a substrate processing apparatus comprising a processing chamber, a rotatable substrate support configured to hold a substrate in the processing chamber, a freezing device that is in contact with or separated from the substrate support and is configured to cool the substrate support, a mechanism configured to rotate the substrate support and raise and lower the freezing device, a power supply part configured to supply a radio frequency (RF) power, and a power supply line that penetrates through the freezing device, has a contact portion, and is configured to switch supply and stop of supply of the RF power by connecting the contact portion to a specific position of the substrate support or disconnecting the contact portion from the specific position of the substrate support.
