18511607. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Myung Soo Noh of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18511607 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application consists of various components arranged in a specific configuration on a substrate.
Key Features and Innovation:
- First and second active patterns extending in a horizontal direction.
- Gate electrode and source/drain region for controlling the flow of current.
- Through-vias within the substrate connecting different components vertically.
- Upper interlayer insulating layer for protection and insulation.
- Continuous reduction in the width of the through-via as it approaches the lower surface of the substrate.
Potential Applications: This technology could be used in the manufacturing of advanced semiconductor devices for various electronic applications such as integrated circuits, microprocessors, and memory chips.
Problems Solved: The technology addresses the need for efficient and compact semiconductor devices with improved performance and reliability.
Benefits:
- Enhanced functionality and performance of semiconductor devices.
- Increased miniaturization and integration of components.
- Improved reliability and durability of electronic devices.
Commercial Applications: The technology could have significant commercial applications in the semiconductor industry, leading to the development of more advanced and efficient electronic devices.
Prior Art: For information on prior art related to this technology, researchers can explore patents and research papers in the field of semiconductor device manufacturing and design.
Frequently Updated Research: Researchers and industry experts are continually exploring new ways to enhance semiconductor device performance, efficiency, and reliability through innovative design and manufacturing techniques.
Questions about Semiconductor Device Technology: 1. What are the key components of a semiconductor device? 2. How does the configuration of components impact the performance of a semiconductor device?
Original Abstract Submitted
A semiconductor device includes a substrate, a first active pattern extending in a first horizontal direction, a second active pattern extending in the first horizontal direction and spaced apart from the first active pattern in a second horizontal direction, a gate electrode extending in the second horizontal direction, a source/drain region disposed on a side of the gate electrode, a first through-via disposed inside the substrate between the first and second active patterns, an upper interlayer insulating layer covering the source/drain region, and a second through-via connected to the first through-via by passing through the upper interlayer insulating layer in a vertical direction spaced apart from the source/drain region in the second horizontal direction. A width of the first through-via in the second horizontal direction is continuously reduced as the first through-via becomes adjacent to the lower surface of the substrate.
