18510056. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18510056 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS
Simplified Explanation
The semiconductor package described in the patent application includes a flexible insulating substrate with wiring on both surfaces, vias connecting the wiring, semiconductor devices on one surface, and a heat dissipation resin layer covering at least one semiconductor device.
- Flexible insulating substrate with wiring on both surfaces
- Vias connecting the wiring
- Semiconductor devices on one surface
- Heat dissipation resin layer covering at least one semiconductor device
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other portable electronics that require efficient heat dissipation and compact packaging.
Problems Solved
This technology solves the problem of heat dissipation in semiconductor devices by providing a heat dissipation resin layer that helps in cooling the devices during operation.
Benefits
The benefits of this technology include improved thermal management, increased reliability and longevity of semiconductor devices, and the ability to design more compact and efficient electronic devices.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of high-performance computing devices, where efficient heat dissipation is crucial for optimal performance.
Possible Prior Art
One possible prior art for this technology could be the use of heat sinks or fans for heat dissipation in semiconductor devices. However, the use of a heat dissipation resin layer as described in this patent application is a novel approach to solving the heat dissipation issue.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods in terms of efficiency and cost?
This article does not provide a direct comparison between this technology and traditional heat dissipation methods. Further research or testing would be needed to determine the efficiency and cost-effectiveness of this technology compared to traditional methods.
What impact could this technology have on the overall performance and lifespan of electronic devices?
While the benefits of this technology are mentioned in the article, the specific impact on the overall performance and lifespan of electronic devices is not discussed. Additional studies or data would be needed to evaluate the extent of this impact.
Original Abstract Submitted
A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a plurality of semiconductor devices on the first surface of the flexible insulating substrate, and a heat dissipation resin layer at least partially covering at least one semiconductor device of the plurality of semiconductor devices.
