18509104. APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Prior Art
- 1.10 Frequently Updated Research
- 1.11 Questions about Semiconductor Manufacturing Apparatus
- 1.12 Original Abstract Submitted
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Fumitaka Moroishi of Yokohama City (JP)
Tatsuya Ishimoto of Yokohama City (JP)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18509104 titled 'APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
Simplified Explanation
The semiconductor manufacturing apparatus described in the patent application includes a pick-up head with ejection and suction holes for gas. It also has a warpage measurement portion to measure chip warpage and a controller to adjust gas flow rates based on the measured warpage.
- The apparatus has a pick-up head with ejection and suction holes for gas.
- It includes a warpage measurement portion to measure chip warpage.
- A controller adjusts gas flow rates based on the measured warpage.
Potential Applications
This technology can be used in various semiconductor manufacturing processes where precise chip handling is crucial. It can improve the reliability and accuracy of chip mounting procedures.
Problems Solved
The technology addresses issues related to chip warpage during semiconductor manufacturing, ensuring better chip handling and mounting accuracy.
Benefits
- Improved reliability in chip mounting processes.
- Enhanced accuracy in chip handling.
- Increased efficiency in semiconductor manufacturing.
Commercial Applications
Title: Advanced Semiconductor Manufacturing Apparatus for Precise Chip Handling This technology can be utilized in semiconductor fabrication facilities to enhance the quality and efficiency of chip mounting processes, potentially leading to higher yields and reduced production costs.
Prior Art
Information on prior art related to this technology is not provided in the patent application.
Frequently Updated Research
There is no information on frequently updated research relevant to this technology.
Questions about Semiconductor Manufacturing Apparatus
Question 1
How does the pick-up head in the semiconductor manufacturing apparatus contribute to improved chip handling?
The pick-up head's design with ejection and suction holes allows for precise gas control, enhancing chip handling accuracy.
Question 2
What role does the warpage measurement portion play in the semiconductor manufacturing apparatus?
The warpage measurement portion helps in assessing chip warpage, enabling the controller to make necessary adjustments to gas flow rates for optimal chip mounting.
Original Abstract Submitted
In order to provide a semiconductor manufacturing apparatus capable of realizing highly reliable mounting, a semiconductor manufacturing apparatus includes a pick-up head having a plurality of ejection holes for ejecting gas and a plurality of suction holes for suctioning the gas provided in a holding surface that holds a chip. A warpage measurement portion is configured to measure warpage of the chip held by the pick-up head, and a controller is configured to control at least one of a gas supply flow rate from the plurality of ejection holes and a suction flow rate from the plurality of suction holes in response to the measured warpage of the chip.
