18508612. SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Organization Name

KABUSHIKI KAISHA TOSHIBA

Inventor(s)

Kazushiro Nomura of Kawasaki Kanagawa (JP)

Kenichi Ohashi of Kawasaki Kanagawa (JP)

Soichi Yamashita of Kawasaki Kanagawa (JP)

Kentaro Mori of Fujisawa Kanagawa (JP)

Aya Murayoshi of Ichihara Chiba (JP)

Hiroki Okuyama of Yokohama Kanagawa (JP)

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18508612 titled 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of a first electrode with two main surfaces, a semiconductor substrate placed on one of the main surfaces, and a second electrode on the opposite side of the semiconductor substrate.

• The first electrode has side surfaces perpendicular to the main surfaces, connected by a curved surface.
• The second electrode is positioned on the semiconductor substrate, creating a unique configuration for the device.

Potential Applications: - This semiconductor device could be used in electronic circuits and devices that require precise control and efficient energy transfer. - It may find applications in power electronics, sensors, and communication systems.

Problems Solved: - The device addresses the need for compact and efficient semiconductor components in modern electronics. - It provides a novel design for electrode placement and connection within a semiconductor device.

Benefits: - Improved performance and reliability in electronic systems. - Enhanced energy efficiency and compactness in semiconductor devices.

Commercial Applications: Title: Innovative Semiconductor Device for Enhanced Electronic Systems This technology could be utilized in various industries such as telecommunications, automotive, and consumer electronics for improved functionality and performance.

Questions about the Semiconductor Device: 1. How does the curved surface connecting the side surfaces of the first electrode contribute to the overall performance of the device?

  The curved surface allows for efficient energy transfer and precise control within the semiconductor device.

2. What advantages does the unique electrode configuration offer compared to traditional semiconductor devices?

  The unique electrode configuration enhances performance, reliability, and energy efficiency in electronic systems.

Original Abstract Submitted

A semiconductor device according to an embodiment includes a first electrode having a first main surface and a second main surface opposite to the first main surface, a semiconductor substrate disposed on the second main surface, and a second electrode disposed on a fourth main surface of the semiconductor substrate opposite to a third main surface in contact with the first electrode. The first electrode has a first side surface substantially perpendicularly intersecting with the first main surface, and a second side surface substantially perpendicularly intersecting with both the first main surface and the first side surface, and the first main surface, the first side surface, and the second side surface are connected to each other via a curved surface.