18508566. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Byeong Seon Park of Suwon-si (KR)
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18508566 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The method described in the patent application involves manufacturing a semiconductor device by forming a stack on a wafer, which includes multiple layers. A photoresist pattern is then formed on the stack. The method includes determining if there have been any changes in the material of a layer or in the processes used to form the layers of the stack. If changes are detected, the wavelength for overlay measurement is adjusted accordingly, and the overlay is measured using the new wavelength.
- Formation of a stack on a wafer with multiple layers
- Formation of a photoresist pattern on the stack
- Detection of changes in material or processes of the stack layers
- Adjustment of wavelength for overlay measurement based on detected changes
- Measurement of overlay using the adjusted wavelength
Potential Applications: - Semiconductor manufacturing industry - Integrated circuit production - Nanotechnology research and development
Problems Solved: - Ensuring accurate overlay measurement in semiconductor device manufacturing - Detecting and adapting to changes in material or processes during manufacturing
Benefits: - Improved accuracy in overlay measurement - Enhanced quality control in semiconductor manufacturing - Increased efficiency in production processes
Commercial Applications: Title: Advanced Overlay Measurement Method for Semiconductor Manufacturing This technology could be used in the production of various semiconductor devices, such as microprocessors, memory chips, and sensors. It can help semiconductor manufacturers improve their production processes and ensure the quality of their products.
Questions about the technology: 1. How does the method described in the patent application improve overlay measurement accuracy in semiconductor manufacturing? 2. What are the potential implications of adjusting the wavelength for overlay measurement based on changes in material or processes during manufacturing?
Original Abstract Submitted
A method for manufacturing a semiconductor device, the method including forming a stack on a wafer, wherein the stack includes a plurality of layers of the stack, forming a photoresist pattern on the stack, determining whether a material of at least one layer among the plurality of layers of the stack has changed and whether at least one process among a plurality of processes for forming the plurality of layers of the stack has changed, changing a first wavelength for overlay measurement upon determination that the material of the at least one layer or the at least one process has changed, and measuring an overlay using the changed first wavelength for overlay measurement.
