18507571. SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18507571 titled 'SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE
The semiconductor package described in the patent application consists of a stack structure on a package substrate, with a lower structure and an upper structure containing multiple semiconductor chips arranged in a cascade structure.
- The upper structure includes several semiconductor chips offset from each other in a horizontal direction and stacked vertically.
- A reinforcing structure is present on the upper structure, consisting of a reinforcing chip and an interfacial layer covering the top surface of the reinforcing chip.
- An encapsulant covers the package substrate, providing protection and stability to the entire package.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, industrial machinery, and other high-tech equipment.
Problems Solved: - The design addresses the need for a compact and efficient way to stack multiple semiconductor chips in a package. - It provides structural reinforcement to prevent damage and ensure the reliability of the semiconductor chips.
Benefits: - Improved performance and reliability of electronic devices. - Space-saving design for compact devices. - Enhanced durability and protection for semiconductor chips.
Commercial Applications: The semiconductor package innovation could be highly sought after by electronics manufacturers looking to improve the performance and reliability of their products. It could also attract interest from industries requiring robust and efficient electronic components.
Questions about the semiconductor package design: 1. How does the reinforcing structure enhance the reliability of the semiconductor chips? 2. What are the potential cost implications of implementing this stack structure in electronic devices?
Original Abstract Submitted
A semiconductor package comprising a stack structure disposed on a package substrate and that includes a lower structure and an upper structure on the lower structure, the upper structure including a plurality of semiconductor chips offset from each other in a first horizontal direction and stacked in a cascade structure, a reinforcing structure on the upper structure and including a reinforcing chip and an interfacial layer covering an upper surface of the reinforcing chip, and an encapsulant covering the package substrate. The plurality of semiconductor chips include a first semiconductor chip disposed directly below the reinforcing structure and a second semiconductor chip disposed directly below the first semiconductor chip. The reinforcing structure covers an overhanging portion of the first semiconductor chip in which the first semiconductor chip does not overlap the second semiconductor chip in a vertical direction, and the interfacial layer and the encapsulant include the same material.
