18506538. Electronic Device simplified abstract (SEIKO EPSON CORPORATION)
Contents
- 1 Electronic Device
Electronic Device
Organization Name
Inventor(s)
Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18506538 titled 'Electronic Device
Simplified Explanation
The patent application describes an electronic device with a lead structure that is joined to the substrate via a conductive joint member. The lead includes a base end portion, a distal end portion, and a coupling portion, with specific angles and distances between components.
- The lead structure of the electronic device is designed to optimize the connection between the electronic component and the substrate.
- The angle and distance measurements of the lead components ensure proper alignment and connection within the device.
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of ensuring a secure and reliable connection between electronic components and the substrate in electronic devices.
Benefits
The benefits of this technology include improved performance, reliability, and durability of electronic devices due to the optimized lead structure design.
Potential Commercial Applications
The optimized lead structure design could be attractive to manufacturers of electronic devices looking to improve the quality and performance of their products.
Possible Prior Art
There may be prior art related to lead structures in electronic devices, but specific details would need to be researched to determine any existing patents or technologies.
Unanswered Questions
How does this technology compare to existing lead structures in electronic devices?
The article does not provide a direct comparison between this technology and existing lead structures in electronic devices. Further research and analysis would be needed to determine the specific advantages and differences.
What specific electronic components or devices could benefit most from this technology?
The article does not specify which electronic components or devices could benefit most from this technology. A more detailed analysis of potential applications would be necessary to answer this question accurately.
Original Abstract Submitted
An electronic device includes a substrate having a first surface and a second surface in a front-back relation, a first electronic component mounted on the second surface, and a lead joined to the second surface of the substrate via a conductive joint member, wherein the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and θ, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is θ, a distance between the first electronic component and the terminal surface in the thickness direction of the substrate is d, a distance between a boundary part between the base end portion and the coupling portion and the joint member in the direction along the substrate is d, and arctan(d/d)=θ
