18505608. METHODS OF SEPARATING A SUBSTRATE simplified abstract (CORNING INCORPORATED)
Contents
METHODS OF SEPARATING A SUBSTRATE
Organization Name
Inventor(s)
Yuvanash Kasinathan of Germering (DE)
Ralf Joachim Terbrueggen of Neuried (DE)
METHODS OF SEPARATING A SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18505608 titled 'METHODS OF SEPARATING A SUBSTRATE
Simplified Explanation
The patent application describes a method of laser processing glass material by applying water to the surface, positioning the glass material on a support surface, and using a laser to expand the water within perforations to separate the material.
- Glass material is placed on a substrate support surface with water applied to the top surface.
- The glass material has perforations along a cutting line that extend through its thickness.
- Water enters the perforations via capillary action.
- A laser is used to expand the water within the perforations to separate the material.
Potential Applications
This technology could be used in industries such as glass manufacturing, electronics, and automotive for precise cutting and processing of glass materials.
Problems Solved
This method solves the problem of achieving clean and precise cuts in glass materials without causing damage or cracks.
Benefits
The benefits of this technology include increased efficiency in glass processing, reduced material waste, and improved accuracy in cutting operations.
Potential Commercial Applications
"Advanced Laser Glass Cutting Technology for Precision Manufacturing"
Possible Prior Art
Prior art may include traditional methods of glass cutting using mechanical tools or other laser cutting techniques.
== Unanswered Questions
=== How does this method compare to traditional glass cutting techniques in terms of speed and precision? This article does not provide a direct comparison between this method and traditional glass cutting techniques. Further research or testing would be needed to determine the speed and precision differences.
=== Are there any limitations to the size or thickness of glass materials that can be processed using this method? The article does not specify any limitations regarding the size or thickness of glass materials that can be processed. Additional information or experimentation may be required to determine any constraints.
Original Abstract Submitted
The disclosure relates to a method of laser processing a glass material, including: applying a layer of water to a top surface of a substrate support surface; positioning the glass material onto the substrate support surface, wherein the glass material comprises: a first surface, a second surface opposing the first surface, a plurality of perforations formed within the glass material along a cutting line, wherein the plurality of perforations extends through a thickness of the material from the first surface to the second surface, wherein the water enters into the plurality of perforations via capillary action; and applying a laser to the glass material at the cutting line to expand the water within the plurality of perforations to separate the material.
