18505569. SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)
Contents
- 1 SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Gabriele Bellocchi of Catania (IT)
Simone Rascuna' of Catania (IT)
Valeria Puglisi of Catania (IT)
SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18505569 titled 'SIC-BASED ELECTRONIC DEVICE WITH MULTILAYER AND MULTIFUNCTIONAL PASSIVATION, AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
Simplified Explanation
The electronic device described in the patent application includes a solid body with a Silicon Carbide substrate, an electrical terminal on the substrate, a passivation layer on the electrical terminal, and a first adhesion improving layer coupled to the passivation layer and the solid body.
- Silicon Carbide substrate
- Electrical terminal on the substrate
- Passivation layer on the electrical terminal
- First adhesion improving layer coupled to the passivation layer and the solid body
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, sensors, and semiconductor components.
Problems Solved
This technology helps improve the adhesion between different layers in electronic devices, enhancing their performance and reliability.
Benefits
The use of a first adhesion improving layer can increase the durability and longevity of electronic devices, leading to better overall performance.
Potential Commercial Applications
- Advanced electronics manufacturing
- Semiconductor industry applications
Possible Prior Art
There may be prior art related to the use of adhesion improving layers in electronic devices, but specific examples are not provided in this patent application.
Unanswered Questions
How does the first adhesion improving layer impact the overall performance of the electronic device?
The patent application mentions the use of a first adhesion improving layer, but does not elaborate on how this layer specifically enhances the device's performance.
Are there any limitations to the materials that can be used for the first adhesion improving layer?
The patent application mentions a second material with predefined characteristics of adhesion, but it does not discuss any potential limitations or constraints in selecting this material.
Original Abstract Submitted
Electronic device, comprising: a solid body including a Silicon Carbide substrate, and further including an electrical terminal of the electronic device on the substrate; a passivation layer on the electrical terminal, of a first material; and a first adhesion improving layer coupled to the passivation layer and to the solid body, of a second material having predefined characteristics of adhesion to the first material, and configured to bond together the passivation layer and the solid body.
