18503690. SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER
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SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18503690 titled 'SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER
The semiconductor package described in the patent application consists of a package substrate, an interposer on the package substrate, and a semiconductor chip on the interposer. The interposer includes a semiconductor substrate and a dielectric layer with a scribe lane region.
- The semiconductor package includes a package substrate, an interposer, and a semiconductor chip.
- The interposer has a semiconductor substrate and a dielectric layer with a scribe lane region.
- The scribe lane region is positioned below the semiconductor chip in a direction perpendicular to the top surface of the semiconductor substrate.
- The scribe lane region is spaced apart from the lateral surface of the interposer.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in high-tech applications such as smartphones, computers, and automotive systems.
Problems Solved: - Enhances the thermal management and electrical connectivity of semiconductor packages. - Optimizes the layout and design of semiconductor components for better overall performance.
Benefits: - Improved thermal dissipation for semiconductor chips. - Enhanced electrical performance and reliability. - Compact design for space-constrained electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, laptops, and automotive systems. The improved thermal management and electrical connectivity offered by this innovation can lead to more efficient and reliable electronic products in the market.
Questions about Semiconductor Packaging Technology: 1. How does the scribe lane region in the interposer contribute to the overall performance of the semiconductor package? The scribe lane region in the interposer helps in optimizing the layout and design of semiconductor components, enhancing thermal dissipation, and improving electrical connectivity.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production? Implementing this technology in mass production may require specialized equipment and processes, as well as thorough testing and validation to ensure consistent performance and reliability.
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer disposed on the package substrate, and a first semiconductor chip disposed on the interposer. The interposer includes a first semiconductor substrate and a first dielectric layer disposed on the first semiconductor substrate. The first dielectric layer includes a first scribe lane region. The first scribe lane region is below the first semiconductor chip along a first direction that is perpendicular to a top surface of the first semiconductor substrate. The first scribe lane region is spaced apart from a lateral surface of the interposer.
