18503543. SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract (HYUNDAI MOBIS CO., LTD.)
Contents
SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Yoon Ju Kim of Hwaseong-si (KR)
Jeong Kwang Seo of Seongnam-si (KR)
Yu Cheol Park of Anyang-si (KR)
SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18503543 titled 'SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME
The abstract describes a single-sided cooling power module with a pattern on a direct bonded copper (DBC) substrate for conducting electricity, a power device chip, a power terminal, and a signal pin.
- The cooling power module includes a pattern on a DBC substrate for conducting electricity.
- A power device chip is placed on the DBC substrate and electrically connected to the pattern.
- A power terminal is coupled to the DBC substrate and electrically connected to the pattern.
- A signal pin extends perpendicularly to the DBC substrate's surface, facing the power device chip, and is electrically connected to the pattern.
Potential Applications: - Power electronics - Electric vehicles - Renewable energy systems
Problems Solved: - Efficient cooling of power modules - Enhanced electrical conductivity - Improved thermal management
Benefits: - Increased power module performance - Better heat dissipation - Enhanced reliability and longevity
Commercial Applications: Title: "Innovative Single-Sided Cooling Power Modules for Enhanced Performance" This technology can be used in various industries such as automotive, aerospace, and renewable energy for improved power module efficiency and reliability.
Questions about the technology: 1. How does the single-sided cooling design improve the performance of power modules? 2. What are the key advantages of using a DBC substrate in this cooling power module design?
Original Abstract Submitted
Single-sided cooling power module and methods of manufacturing are disclosed where the cooling power module includes a pattern formed on a direct bonded copper (DBC) substrate to conduct electricity, a power device chip disposed on the DBC substrate and electrically connected to the pattern, a power terminal coupled to the DBC substrate and electrically connected to the pattern, and a signal pin extending in a direction perpendicular to a surface of the DBC substrate and facing the power device chip, the signal pin being electrically connected to the pattern.
