18502702. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18502702 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a lower substrate, a lower device positioned at the center of the lower substrate, an upper substrate placed on top of the lower device and the lower substrate, and multiple post electrodes connecting the lower substrate to the upper substrate. Additionally, there are passive devices located between the post electrodes and the edge of the lower substrate, which further connect the post electrodes to the lower substrate.
- Lower substrate with a lower device at the center
- Upper substrate on top of the lower device
- Post electrodes connecting the lower substrate to the upper substrate
- Passive devices between post electrodes and the edge of the lower substrate
- Passive devices connecting post electrodes to the lower substrate
Potential Applications: - Integrated circuits - Electronic devices - Semiconductor manufacturing
Problems Solved: - Improved connectivity between substrates - Enhanced performance of semiconductor packages
Benefits: - Increased efficiency in electronic devices - Enhanced reliability of integrated circuits
Commercial Applications: Title: Semiconductor Package Technology for Enhanced Connectivity This technology can be utilized in the production of various electronic devices, leading to improved performance and reliability. The market implications include increased demand for advanced semiconductor packages in the electronics industry.
Prior Art: Readers can start their search for prior art related to this technology by exploring patents in the field of semiconductor packaging, specifically focusing on innovations in substrate connectivity and passive device integration.
Frequently Updated Research: Researchers are constantly exploring new methods to enhance the connectivity and performance of semiconductor packages. Stay updated on the latest advancements in this field to ensure the utilization of cutting-edge technology.
Questions about Semiconductor Package Technology: 1. How does the integration of passive devices improve the connectivity of the semiconductor package? Passive devices play a crucial role in connecting the post electrodes to the lower substrate, thereby enhancing the overall connectivity and performance of the semiconductor package.
2. What are the potential applications of this semiconductor package technology beyond integrated circuits? This technology can be applied in various electronic devices to improve connectivity and reliability, expanding its potential applications beyond just integrated circuits.
Original Abstract Submitted
A semiconductor package includes a lower substrate, a lower device on a center of the lower substrate, an upper substrate on the lower device and the lower substrate, and a plurality of post electrodes between a region adjacent an edge of the lower substrate and a region adjacent an edge of the upper substrate. The plurality of post electrodes connect the lower substrate to the upper substrate. A plurality of passive devices are between the plurality of post electrodes and the region adjacent the edge of the lower substrate and connect the plurality of post electrodes to the lower substrate.
