18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.)
Contents
- 1 CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
Organization Name
Inventor(s)
Pei-Haw Tsao of Hsinchu City (TW)
Te-Chi Wong of Hsinchu City (TW)
CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18502105 titled 'CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
Simplified Explanation
The coreless substrate package described in the patent application includes a coreless substrate with a package device mounted on it, an underfill material filling the space between the package device and the coreless substrate, a stiffener ring on the top surface of the coreless substrate along its perimeter, and a gap fill material in the gap between the stiffener ring and the package device.
- Coreless substrate package with package device and underfill material
- Stiffener ring on top surface of coreless substrate
- Gap fill material between stiffener ring and package device
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Electronics packaging
- Semiconductor manufacturing
- Microelectronics assembly
Problems Solved
This technology helps address the following issues:
- Improving structural integrity of electronic components
- Enhancing thermal management in electronic devices
- Minimizing stress on package devices during operation
Benefits
The coreless substrate package offers the following benefits:
- Reduced risk of package device damage
- Improved reliability of electronic systems
- Enhanced performance of electronic components
Potential Commercial Applications
The coreless substrate package technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Aerospace and defense systems
Possible Prior Art
One possible prior art in this field is the use of traditional substrate packages with rigid cores, which may not offer the same level of flexibility and thermal management as the coreless substrate package described in this patent application.
Unanswered Questions
How does the stiffness of the stiffener ring impact the overall performance of the coreless substrate package?
The stiffness of the stiffener ring could affect the structural integrity and thermal characteristics of the package, but the specific details are not provided in the abstract.
What materials are typically used for the gap fill material in coreless substrate packages?
The abstract mentions the presence of a gap fill material, but does not specify the materials commonly used for this purpose.
Original Abstract Submitted
A coreless substrate package includes a coreless substrate; a package device mounted on a coreless substrate; an underfill material filling into a space between the package device and the coreless substrate; a stiffener ring disposed on a top surface of the coreless substrate along perimeter of the coreless substrate; and a gap fill material disposed in a gap between the stiffener ring and the package device.
