18501124. ELEMENT CHIP MANUFACTURING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
Contents
- 1 ELEMENT CHIP MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELEMENT CHIP MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELEMENT CHIP MANUFACTURING METHOD
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
Hidehiko Karasaki of HYOGO (JP)
Toshiyuki Takasaki of OSAKA (JP)
ELEMENT CHIP MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18501124 titled 'ELEMENT CHIP MANUFACTURING METHOD
Simplified Explanation
The disclosed element chip manufacturing method includes: a first step of imparting hydrophilicity to a first surface of a substrate, the first surface including element regions A and dicing regions B defining the element regions A; a second step of applying a raw material liquid containing a water-soluble resin onto the first surface, to form a water-soluble resin layer on the first surface; a third step of applying a laser beam to the water-soluble resin layer covering the dicing regions B, to form openings that expose the dicing regions B, in the water-soluble resin layer; a fourth step of etching the dicing regions B exposed at the openings, with plasma, to obtain element chips; and a fifth step of removing the water-soluble resin layer by bringing the element chips into contact with a water-containing cleaning liquid.
- Impart hydrophilicity to a substrate surface.
- Apply a raw material liquid containing a water-soluble resin to form a resin layer.
- Use a laser beam to create openings in the resin layer.
- Etch the exposed dicing regions with plasma to obtain element chips.
- Remove the resin layer by cleaning with a water-containing liquid.
Potential Applications
The technology can be applied in semiconductor manufacturing, electronic device production, and microchip fabrication industries.
Problems Solved
This method streamlines the process of manufacturing element chips by efficiently etching dicing regions and removing the resin layer, resulting in high-quality chips.
Benefits
The benefits of this technology include improved efficiency, precision in chip manufacturing, and reduced production costs.
Potential Commercial Applications
"Element Chip Manufacturing Method for Semiconductor Industry"
Possible Prior Art
There may be prior art related to laser etching techniques in semiconductor manufacturing processes that could be relevant to this technology.
Unanswered Questions
How does this method compare to traditional etching processes in terms of efficiency and cost-effectiveness?
The article does not provide a direct comparison between this method and traditional etching processes in semiconductor manufacturing.
What are the specific characteristics of the water-soluble resin used in this method, and how does it contribute to the overall effectiveness of the process?
The article does not delve into the specific properties or characteristics of the water-soluble resin utilized in this manufacturing method.
Original Abstract Submitted
The disclosed element chip manufacturing method includes: a first step of imparting hydrophilicity to a first surface of a substrate , the first surface including element regions A and dicing regions B defining the element regions A; a second step of applying a raw material liquid containing a water-soluble resin onto the first surface , to form a water-soluble resin layer on the first surface ; a third step of applying a laser beam to the water-soluble resin layer covering the dicing regions B, to form openings that expose the dicing regions B, in the water-soluble resin layer ; a fourth step of etching the dicing regions B exposed at the openings , with plasma, to obtain element chips ; and a fifth step of removing the water-soluble resin layer by bringing the element chips into contact with a water-containing cleaning liquid.
