18499871. METAL SENSE LINE CONTACT simplified abstract (Micron Technology, Inc.)
Contents
- 1 METAL SENSE LINE CONTACT
METAL SENSE LINE CONTACT
Organization Name
Inventor(s)
Ping Chieh Chiang of Boise ID (US)
METAL SENSE LINE CONTACT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18499871 titled 'METAL SENSE LINE CONTACT
Simplified Explanation
The patent application describes methods, apparatuses, and systems related to a metal sense line contact. The apparatus includes a sense line pillar with multiple layers of materials over a semiconductor substrate, including a barrier material, liner material, first metal material, second metal material, and cap material. The apparatus also includes cell contacts between multiple sense line pillars.
- The apparatus includes a sense line pillar with multiple layers of materials over a semiconductor substrate.
- The sense line pillar includes a barrier material, liner material, first metal material, second metal material, and cap material.
- The apparatus includes cell contacts between multiple sense line pillars.
Potential Applications
The technology described in the patent application could be applied in semiconductor manufacturing, specifically in the development of metal sense line contacts for electronic devices.
Problems Solved
This technology solves the problem of efficiently creating metal sense line contacts on semiconductor substrates, improving the performance and reliability of electronic devices.
Benefits
The benefits of this technology include enhanced conductivity, improved signal transmission, and increased durability of metal sense line contacts in electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the production of advanced electronic devices with more efficient and reliable metal sense line contacts.
Possible Prior Art
One possible prior art for this technology could be the use of different materials and structures for metal sense line contacts in semiconductor devices.
Unanswered Questions
How does this technology compare to existing metal sense line contact designs in terms of performance and reliability?
This question is not directly addressed in the patent application. Further testing and comparison studies would be needed to determine the performance and reliability of this technology compared to existing designs.
What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
The cost implications of implementing this technology are not discussed in the patent application. A cost analysis would be necessary to understand the economic feasibility of using this technology in semiconductor manufacturing.
Original Abstract Submitted
Methods, apparatuses, and systems related to a metal sense line contact are described. An example apparatus includes a sense line pillar comprising a barrier material over a semiconductor substrate. The sense line pillar further includes a liner material adjacent the barrier material. The sense line pillar further includes a first metal material over the barrier material. The sense line pillar further includes a second metal material over the first metal material. The sense line pillar further includes a cap material over the second metal material. The apparatus further cell contacts between a plurality of sense line pillars.
