18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)
Contents
- 1 PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18497637 titled 'PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
Simplified Explanation
The abstract describes a semiconductor device assembly where a semiconductor package includes a substrate, a semiconductor die, and a passive electronic component on the die.
- The semiconductor device assembly includes a substrate, semiconductor die, and passive electronic component.
- The passive electronic component is disposed on the semiconductor die.
Potential Applications
This technology could be applied in:
- Consumer electronics
- Automotive industry
- Telecommunications
Problems Solved
This technology helps in:
- Improving performance of semiconductor devices
- Enhancing reliability of electronic components
Benefits
The benefits of this technology include:
- Increased efficiency
- Compact design
- Enhanced functionality
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Manufacturing of electronic devices
- Semiconductor industry
Possible Prior Art
One possible prior art could be:
- Existing semiconductor packaging technologies
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison to existing methods.
What specific passive electronic components can be integrated onto the semiconductor die?
The article does not specify the types of passive electronic components that can be integrated.
Original Abstract Submitted
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor package includes a substrate, a semiconductor die disposed on the substrate, and a passive electronic component disposed on the semiconductor die.
