18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)

From WikiPatents
Jump to navigation Jump to search

PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE

Organization Name

Micron Technology, Inc.

Inventor(s)

Kelvin Aik Boo Tan of Singapore (SG)

Hong Wan Ng of Singapore (SG)

See Hiong Leow of Singapore (SG)

Seng Kim Ye of Singapore (SG)

Ling Pan of Singapore (SG)

PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18497637 titled 'PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE

Simplified Explanation

The abstract describes a semiconductor device assembly where a semiconductor package includes a substrate, a semiconductor die, and a passive electronic component on the die.

  • The semiconductor device assembly includes a substrate, semiconductor die, and passive electronic component.
  • The passive electronic component is disposed on the semiconductor die.

Potential Applications

This technology could be applied in:

  • Consumer electronics
  • Automotive industry
  • Telecommunications

Problems Solved

This technology helps in:

  • Improving performance of semiconductor devices
  • Enhancing reliability of electronic components

Benefits

The benefits of this technology include:

  • Increased efficiency
  • Compact design
  • Enhanced functionality

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Manufacturing of electronic devices
  • Semiconductor industry

Possible Prior Art

One possible prior art could be:

  • Existing semiconductor packaging technologies

Unanswered Questions

How does this technology compare to existing semiconductor packaging methods?

This article does not provide a direct comparison to existing methods.

What specific passive electronic components can be integrated onto the semiconductor die?

The article does not specify the types of passive electronic components that can be integrated.


Original Abstract Submitted

Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor package includes a substrate, a semiconductor die disposed on the substrate, and a passive electronic component disposed on the semiconductor die.