18496920. MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

JEN-YUAN Chang of Hsinchu (TW)

MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18496920 titled 'MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE

Simplified Explanation

The abstract describes a method of manufacturing a semiconductor package involving bonding multiple die groups of varying thicknesses to a substrate and encapsulating them with a carrier substrate containing air gaps.

• Provides a method for manufacturing a semiconductor package with multiple die groups of different thicknesses.
• Involves bonding the die groups to a substrate.
• Encapsulates the die groups with a carrier substrate containing air gaps.
• Ensures the carrier substrate has a thickness equal to or greater than the difference between the thicknesses of the die groups.

Potential Applications

• Semiconductor industry for manufacturing advanced semiconductor packages.
• Electronics industry for creating high-performance electronic devices.

Problems Solved

• Efficiently bonding die groups of varying thicknesses to a substrate.
• Providing a solution for encapsulating die groups with a carrier substrate containing air gaps.

Benefits

• Allows for the manufacturing of complex semiconductor packages.
• Enhances the performance and reliability of electronic devices.
• Provides a cost-effective solution for semiconductor packaging.

Original Abstract Submitted

A method of manufacturing a semiconductor package includes: providing a substrate; providing a first die group comprising a first set of one or more dies, wherein the first die group is characterized by a first thickness; bonding a lower surface of the first die group to the substrate; providing a second die group comprising a second set of one or more dies, wherein the second die group is characterized by a second thickness larger than the first thickness; bonding the second die group to the substrate; providing a carrier substrate encapsulating at least one air gap, wherein the carrier substrate is characterized by a third thickness equal to or greater than a difference between the second thickness and the first thickness; and bonding a lower surface of the carrier substrate to an upper surface of the first die group.