18496613. OPTICAL COMMUNICATION DEVICE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
Contents
OPTICAL COMMUNICATION DEVICE
Organization Name
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Inventor(s)
OPTICAL COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18496613 titled 'OPTICAL COMMUNICATION DEVICE
The optical communication device described in the patent application includes a carrier substrate, a printed circuit board on one side of the substrate, electro-absorption modulator-integrated laser chips on the other side, an interposer connecting the chips and the circuit board, and capacitors on the interposer.
- The device features a carrier substrate that houses various components of the optical communication system.
- A printed circuit board is positioned on one side of the carrier substrate in a specific direction.
- Electro-absorption modulator-integrated laser chips are located on the opposite side of the carrier substrate.
- An interposer connects the laser chips and the printed circuit board, facilitating communication between them.
- Capacitors are placed on the interposer, shorter than the laser chips but thicker, enhancing the functionality of the device.
Potential Applications: - This technology can be used in high-speed optical communication systems. - It may find applications in data centers and telecommunications networks for efficient data transmission.
Problems Solved: - The device addresses the need for compact and efficient optical communication devices. - It solves the challenge of integrating various components in a small form factor.
Benefits: - Improved data transmission speeds and efficiency. - Compact design for space-saving in various applications. - Enhanced reliability and performance of optical communication systems.
Commercial Applications: "Optical Communication Device for High-Speed Data Transmission in Data Centers and Telecommunications Networks"
Questions about the technology: 1. How does the integration of electro-absorption modulator-integrated laser chips improve data transmission? 2. What are the advantages of using capacitors on the interposer in this optical communication device?
Original Abstract Submitted
Provided is an optical communication device according to an embodiment of the inventive including a carrier substrate, a printed circuit board provided on one side of the carrier substrate in a first direction, electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate, an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board, and capacitors, which are provided on the interposer and each of which is shorter than each of the electro-absorption modulator-integrated laser chips and is thicker than the electro-absorption modulator-integrated laser chip.
