18496160. PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME simplified abstract (CANON KABUSHIKI KAISHA)
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PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME
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PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18496160 titled 'PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME
Simplified Explanation
The patent application describes a photo-curable composition with high dry etching resistance and thermal stability.
- The composition includes a polymerizable compound and a photopolymerization initiator.
- It also includes a flame retarder or a flame-retardant polymerizable compound.
- Potential Applications:**
- Electronics industry for circuit board manufacturing.
- Aerospace industry for creating heat-resistant components.
- Automotive industry for producing durable parts.
- Problems Solved:**
- Low dry etching resistance in traditional photo-curable compositions.
- Limited thermal stability in existing formulations.
- Benefits:**
- Improved resistance to dry etching processes.
- Enhanced thermal stability for high-temperature applications.
- Increased safety with the inclusion of flame retardant materials.
Original Abstract Submitted
An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.