18495224. WAFER PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)

WAFER PROCESSING APPARATUS

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Hun Yong Park of Suwon-si (KR)

Yeon Tae Kim of Suwon-si (KR)

Jang Hwi Lee of Suwon-si (KR)

Sang Woo Bae of Suwon-si (KR)

Kyung Su Kim of Suwon-si (KR)

Tae Soon Park of Suwon-si (KR)

Jung Chul Lee of Suwon-si (KR)

Sung Ho Jang of Suwon-si (KR)

Won Don Joo of Suwon-si (KR)

WAFER PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18495224 titled 'WAFER PROCESSING APPARATUS

The abstract of the patent application describes a wafer processing apparatus with a chamber that has a first rib on the outer side of a sidewall. The rib has different light transmittance properties in its different portions.

• The wafer processing apparatus includes a chamber with a first rib on the outer side of a sidewall.
• The first rib has different light transmittance properties in its first and second portions.

Potential Applications:

• Semiconductor manufacturing
• Thin film deposition processes
• Solar cell production

Problems Solved:

• Controlling light transmittance in wafer processing chambers
• Improving process efficiency and accuracy

Benefits:

• Enhanced control over processing conditions
• Increased quality and yield of processed wafers

Commercial Applications:

• Semiconductor industry for wafer processing
• Solar energy sector for solar cell production

Questions about the technology: 1. How does the different light transmittance of the rib portions affect the wafer processing? 2. What are the specific advantages of having variable light transmittance in the chamber?

Original Abstract Submitted

A wafer processing apparatus may include a chamber providing an internal space; and a first rib on an outer side of a first sidewall of the chamber. An outer side of the first rib may include a first portion and a second portion. A light transmittance of the first portion may be different from a light transmittance of the second portion.