18495180. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Organization Name

SEMES CO., LTD.

Inventor(s)

Kang Sul Kim of Cheonan-si (KR)

Tae-keun Kim of Cheonan-si (KR)

Junhee Choi of Cheonan-si (KR)

Kyeong Min Lee of Cheonan-si (KR)

Yong Jun Kim of Cheonan-si (KR)

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18495180 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Simplified Explanation

The substrate processing apparatus described in the patent application allows a chemical liquid to penetrate deeply into a gap between patterns of a substrate by utilizing inertial behavior of the liquid. The apparatus includes a housing with a processing space, a rotatable substrate support, a chemical liquid supply, and a controller for applying different rotation speeds to the substrate support.

• Substrate processing apparatus for deep penetration of chemical liquid:

   * Housing with processing space
   * Rotatable substrate support
   * Chemical liquid supply for spraying liquid
   * Controller for applying different rotation speeds

Potential Applications

The technology can be used in the semiconductor industry for etching processes where precise control of chemical liquid penetration is required. It can also be applied in the manufacturing of microelectronics and MEMS devices.

Problems Solved

The apparatus solves the problem of uneven distribution of chemical liquid on the substrate surface by allowing the liquid to penetrate deeply into narrow gaps between patterns. This ensures uniform processing and improved quality of the final product.

Benefits

- Enhanced precision in chemical liquid application - Improved uniformity in substrate processing - Increased efficiency in manufacturing processes

Potential Commercial Applications

"Enhancing Substrate Processing with Deep Chemical Liquid Penetration"

Possible Prior Art

There may be prior art related to substrate processing apparatus with rotating support for liquid application, but the specific use of different rotation speeds to generate inertial behavior of the liquid for deep penetration may be a novel aspect of this technology.

Unanswered Questions

How does the controller determine the optimal rotation speeds for different types of chemical liquids and substrates?

The patent application does not provide details on the specific algorithms or methods used by the controller to determine the appropriate rotation speeds for different combinations of chemical liquids and substrates.

Are there any limitations to the size or shape of substrates that can be processed using this apparatus?

The patent application does not mention any restrictions on the size or shape of substrates that can be accommodated by the processing space of the apparatus. It would be important to know if there are any limitations in this regard for potential users.

Original Abstract Submitted

Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.