18494611. COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Wataru Doi of Nagaokakyo-shi (JP)
COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18494611 titled 'COMPOUND COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation: The patent application describes a compound component device with laminated layers housing electronic components, where some layers are inverted to face each other. The electronic component layers include a main surface, a redistribution layer, and piercing vias for electrical connection.
Key Features and Innovation:
- Compound component device with laminated layers housing electronic components
- Inverted layers configuration for facing each other
- Electronic component layers with main surface, redistribution layer, and piercing vias for electrical connection
Potential Applications: This technology could be used in various electronic devices such as smartphones, tablets, laptops, and other portable electronic devices.
Problems Solved: This technology solves the problem of efficiently housing and connecting electronic components in a compact and reliable manner.
Benefits:
- Compact design
- Efficient housing and connection of electronic components
- Reliable performance
Commercial Applications: The technology can be applied in the consumer electronics industry for the development of smaller, more efficient electronic devices.
Questions about the Technology: 1. How does the inverted layer configuration improve the performance of the compound component device? 2. What are the specific advantages of using piercing vias for electrical connection in electronic component layers?
Frequently Updated Research: There may be ongoing research in the field of compound component devices and electronic component housing techniques that could further enhance the efficiency and performance of this technology.
Original Abstract Submitted
A compound component device including laminated first compound component layers housing first electronic components, in which the first compound component layers each include an electronic component layer, including a first main surface and a second main surface opposed to the first main surface, and a redistribution layer provided on the first main surface. At least two of the plurality of first compound component layers configure an inverted layer for which the first compound component layers are paired and formed so that the second main surfaces face each other. The electronic component layer includes the first electronic component, a first resin sealing portion to seal the first electronic component, a side wall portion that encloses the first electronic component, and electronic component layer piercing vias which pierce the side wall portion and electrically connect with the redistribution layer, and the first electronic component is directly joined to the redistribution layer.
