18494109. Light Emitting Structure simplified abstract (Apple Inc.)
Contents
- 1 Light Emitting Structure
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Light Emitting Structure - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Receiving Micro Devices on Substrates
- 1.13 Original Abstract Submitted
Light Emitting Structure
Organization Name
Inventor(s)
John A. Higginson of Santa Clara CA (US)
Andreas Bibl of Los Altos CA (US)
Hsin-Hua Hu of Los Altos CA (US)
Light Emitting Structure - A simplified explanation of the abstract
This abstract first appeared for US patent application 18494109 titled 'Light Emitting Structure
Simplified Explanation
The patent application describes a method and structure for receiving a micro device on a receiving substrate by punching through a passivation layer covering a conductive layer.
- The micro device, such as a micro LED, is punched through a hardened passivation layer on the receiving substrate.
- The micro LED device can be punched through a B-staged thermoset material or a thermoplastic material.
Key Features and Innovation
- Method for receiving a micro device on a receiving substrate by punching through a passivation layer.
- Use of hardened passivation layer to protect the conductive layer on the receiving substrate.
- Ability to punch through different materials such as B-staged thermoset or thermoplastic.
Potential Applications
- Micro LED devices in display technology.
- Micro devices in medical devices.
- Micro devices in automotive applications.
Problems Solved
- Protecting the conductive layer on the receiving substrate.
- Ensuring proper connection of micro devices.
- Enhancing the durability of micro devices.
Benefits
- Improved reliability of micro devices.
- Enhanced performance of micro devices.
- Simplified manufacturing process.
Commercial Applications
Receiving Micro Devices on Substrates: Innovations in Passivation Layer Punch-Through Technology This technology can be applied in the manufacturing of various electronic devices, medical equipment, and automotive components. The improved method of receiving micro devices on substrates can lead to more reliable and durable products, benefiting industries such as consumer electronics, healthcare, and automotive manufacturing.
Prior Art
Information on prior art related to this technology is not available at the moment.
Frequently Updated Research
There is ongoing research in the field of micro device manufacturing and passivation layer technologies that may impact the development and application of this technology.
Questions about Receiving Micro Devices on Substrates
Question 1
How does punching through a passivation layer improve the connection of micro devices on a receiving substrate?
Answer: Punching through a passivation layer allows for direct contact between the micro device and the conductive layer on the receiving substrate, ensuring a secure and reliable connection.
Question 2
What are the potential challenges in punching through different materials such as thermoset or thermoplastic?
Answer: Some challenges may include the need for specialized tools or techniques to punch through different materials, as well as ensuring the integrity and stability of the passivation layer after punching through.
Original Abstract Submitted
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
