18492946. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18492946 titled 'INTEGRATED CIRCUIT DEVICE
The abstract describes an integrated circuit device with a self-assembled organic material insulating liner between a first plug portion and the substrate.
- Simplified Explanation:
- Integrated circuit device with insulating structure and contact structure. - Self-assembled organic material insulating liner between plug portion and substrate.
- Key Features and Innovation:
- Insulating structure on the substrate's frontside surface. - Contact structure with a first plug portion extending through the substrate. - Self-assembled organic material insulating liner for improved insulation.
- Potential Applications:
- Semiconductor industry for advanced integrated circuits. - Electronics manufacturing for improved device performance.
- Problems Solved:
- Enhanced insulation between plug portion and substrate. - Better integration of contact structure in the device.
- Benefits:
- Improved device reliability. - Enhanced electrical performance. - Potential for smaller and more efficient integrated circuits.
- Commercial Applications:
- Semiconductor manufacturing for high-performance devices. - Electronics industry for improved product quality and reliability.
- Questions about the Technology:
1. How does the self-assembled organic material insulating liner improve device performance? 2. What are the potential challenges in integrating this technology into existing manufacturing processes?
- Frequently Updated Research:
- Ongoing research on self-assembled organic materials for advanced electronic devices.
Original Abstract Submitted
An integrated circuit device includes a substrate, an insulating structure on a frontside surface of the substrate, a contact structure including a first plug portion that extends through the substrate, and a self-assembled organic material insulating liner between the first plug portion and the substrate.
