18492868. Three-Dimensional Shaping Device simplified abstract (SEIKO EPSON CORPORATION)
Contents
Three-Dimensional Shaping Device
Organization Name
Inventor(s)
Manabu Watanabe of Shiojiri (JP)
Makoto Omura of Matsumoto (JP)
Three-Dimensional Shaping Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18492868 titled 'Three-Dimensional Shaping Device
Simplified Explanation: The patent application describes a three-dimensional shaping device that can selectively eject different materials to create complex shapes.
Key Features and Innovation:
- Device includes a stage, ejection portion, moving portion, and control unit.
- Can stack slice layers using materials with different resin properties.
- Executes specific processing steps for each material type to create intricate shapes.
Potential Applications: This technology can be used in additive manufacturing, prototyping, and creating custom-designed objects with varying material properties.
Problems Solved: The device allows for the creation of complex shapes with materials containing different types of resins, expanding the possibilities for 3D printing and shaping processes.
Benefits:
- Enables the production of intricate and customized objects.
- Enhances the capabilities of 3D printing technology.
- Offers flexibility in material selection for shaping processes.
Commercial Applications: The device could be utilized in industries such as aerospace, automotive, and medical for creating specialized components and prototypes with unique material properties.
Prior Art: Readers can explore prior patents related to 3D shaping devices, resin-based additive manufacturing, and multi-material printing techniques to understand the background of this technology.
Frequently Updated Research: Stay informed about advancements in multi-material 3D printing, resin-based additive manufacturing, and innovative shaping technologies to keep up with the latest developments in the field.
Questions about 3D Shaping Devices: 1. What are the potential limitations of using materials with different resin properties in 3D shaping processes? 2. How does the control unit determine the specific processing steps for each material type in the device?
Original Abstract Submitted
A three-dimensional shaping device includes a stage, an ejection portion configured to selectively eject, as a shaping material, a first material containing a crystalline resin and a second material containing an amorphous resin to an upper side of the stage, a moving portion configured to relatively move the stage and the ejection portion, and a control unit. The control unit executes first stacking processing when a plurality of slice layers are stacked using the first material as the shaping material and executes second stacking processing when a plurality of slice layers are stacked using the second material as the shaping material. The first stacking processing includes first slice layer forming processing, first ejection stop processing, first temperature detection processing, and second slice layer forming processing, and the second stacking processing includes third slice layer forming processing, second ejection stop processing, first determination processing, and fourth slice layer forming processing.
