18492170. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18492170 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a first semiconductor chip with a substrate, rear protective layer, rear through-vias, front through-vias, and rear pads. A second semiconductor chip is stacked on top of the first chip, with front pads connected to the rear pads through bump structures. The rear through-vias are wider than the front through-vias.
- The semiconductor package includes a first chip with rear through-vias and front through-vias.
- A second chip is stacked on top of the first chip, with front pads connected to rear pads.
- Rear through-vias are wider than front through-vias.
- Bump structures facilitate electrical connections between the front and rear pads.
- The design aims to improve performance and reliability of the semiconductor package.
Potential Applications: - Advanced electronics manufacturing - Semiconductor industry - Microchip development
Problems Solved: - Enhanced electrical connectivity - Improved signal transmission - Increased reliability in semiconductor packaging
Benefits: - Higher performance capabilities - Enhanced durability - Improved overall functionality
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in various industries such as telecommunications, consumer electronics, and automotive for improved semiconductor packaging solutions.
Prior Art: Researchers can explore prior patents related to semiconductor packaging, through-vias, and bump structures to understand the evolution of this technology.
Frequently Updated Research: Researchers and engineers are continuously exploring new materials and techniques to further enhance semiconductor packaging technologies for future applications.
Questions about Semiconductor Packaging Technology: 1. How does the width difference between rear through-vias and front through-vias impact the performance of the semiconductor package? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip including a substrate having a front surface and an opposite rear surface, a rear protective layer on the rear surface, a plurality of first and second rear through-vias penetrating through the rear protective layer and extending into the substrate, a plurality of front through-vias extending from the front surface and connected to the first rear through-vias, and a plurality of rear pads on the rear protective layer and connected to the plurality of first and second rear through-vias. A second semiconductor chip is on the first semiconductor chip, and includes a plurality of front pads electrically connected to the plurality of rear pads by respective bump structures. Each of the plurality of rear through-vias has a width greater than a width of each of the plurality of front through-vias.
