18491572. RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
- 1 RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE
Organization Name
Inventor(s)
RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18491572 titled 'RECEIVER OPTICAL SUB-ASSEMBLY, BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK DEVICE
Simplified Explanation
The patent application describes example optical sub-assemblies and optical network devices, including a receiver optical sub-assembly with a photodiode, trans-impedance amplifier, and filter component.
- Photodiode converts optical signal to electrical signal
- Trans-impedance amplifier amplifies electrical signal
- Filter component helps in signal processing
- Components are connected to power supply and ground for operation
Potential Applications
The technology described in the patent application can be used in optical communication systems, data transmission networks, and fiber optic sensors.
Problems Solved
This technology solves the problem of efficiently converting optical signals to electrical signals, amplifying them for further processing, and filtering out unwanted noise.
Benefits
The benefits of this technology include improved signal quality, higher data transmission rates, and increased reliability in optical communication systems.
Potential Commercial Applications
The technology can be applied in telecommunications equipment, data centers, fiber optic networks, and other high-speed communication systems.
Possible Prior Art
Prior art may include existing receiver optical sub-assemblies, trans-impedance amplifiers, and photodiode technologies used in optical communication systems.
Unanswered Questions
How does this technology compare to existing optical receiver designs in terms of performance and cost?
This article does not provide a direct comparison with existing optical receiver designs in terms of performance and cost. It would be beneficial to have more information on how this technology stacks up against current solutions in the market.
What are the specific technical specifications and requirements for integrating this technology into different optical network devices?
The article does not delve into the specific technical specifications and requirements for integrating this technology into various optical network devices. More details on compatibility, power requirements, and interface standards would be helpful for potential adopters of this technology.
Original Abstract Submitted
This application provides example receiver optical sub-assemblies, example bi-directional optical sub-assemblies, and example optical network devices. One example receiver optical sub-assembly includes a photodiode, a trans-impedance amplifier, and a first filter component. The photodiode is configured to convert an optical signal into an electrical signal, a positive electrode of the photodiode is connected to an input terminal of the trans-impedance amplifier, and a negative electrode of the photodiode is configured to connect to a power supply. The trans-impedance amplifier is configured to amplify the electrical signal output by the photodiode, where a power terminal of the trans-impedance amplifier is configured to connect to a power supply, and a first ground terminal of the trans-impedance amplifier is configured to connect to an external ground.
